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name:-0.0036559104919434
name:-0.0031330585479736
name:-0.0018999576568604
Higashikubo, Ichiro Patent Filings

Higashikubo, Ichiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higashikubo, Ichiro.The latest application filed is for "non-aqueous laminate adhesive".

Company Profile
0.2.4
  • Higashikubo, Ichiro - Yokohama-shi JP
  • Higashikubo; Ichiro - Yokohama JP
  • Higashikubo; Ichiro - Kanagawa-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Non-aqueous laminate adhesive
App 20040063892 - Morikawa, Yukihiro ;   et al.
2004-04-01
Polyisocyanate curing agent for laminate adhesive, and laminate adhesive using the same
Grant 6,649,084 - Morikawa , et al. November 18, 2
2003-11-18
Polyisocyanate curing agent for laminate adhesive and process for production thereof
Grant 6,596,819 - Morikawa , et al. July 22, 2
2003-07-22
Non-aqueous laminate adhesive
App 20030092868 - Morikawa, Yukihiro ;   et al.
2003-05-15
Polyisocyanate curing agent for laminate adhesive and process for production thereof
App 20030083451 - Morikawa, Yukihiro ;   et al.
2003-05-01
Polyisocyanate curing agent for laminate adhesive, and laminate adhesive using the same
App 20030055197 - Morikawa, Yukihiro ;   et al.
2003-03-20

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