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Higashikawa; Tetsuro Patent Filings

Higashikawa; Tetsuro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higashikawa; Tetsuro.The latest application filed is for "syringe, its sealing structure and sealing method and sliding valve for syringe".

Company Profile
0.4.0
  • Higashikawa; Tetsuro - Tokyo JP
  • Higashikawa; Tetsuro - Meguro-ku Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Syringe, its sealing structure and sealing method and sliding valve for syringe
Grant 5,851,200 - Higashikawa , et al. December 22, 1
1998-12-22
Syringe
Grant 5,830,193 - Higashikawa November 3, 1
1998-11-03
Syringe
Grant 5,704,918 - Higashikawa January 6, 1
1998-01-06
Syringe
Grant 5,599,312 - Higashikawa February 4, 1
1997-02-04

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