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name:-0.0060079097747803
name:-0.0051429271697998
name:-0.00042319297790527
Higashijima; Hirokazu Patent Filings

Higashijima; Hirokazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higashijima; Hirokazu.The latest application filed is for "semiconductor device manufacturing method".

Company Profile
0.4.7
  • Higashijima; Hirokazu - Nirasaki JP
  • Higashijima; Hirokazu - Nirasaki-Shi JP
  • Higashijima; Hirokazu - Yamanashi JP
  • HIGASHIJIMA; Hirokazu - Nirasaki City JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device manufacturing method and substrate treatment system
Grant 9,418,837 - Akiyama , et al. August 16, 2
2016-08-16
Semiconductor Device Manufacturing Method
App 20160181109 - Akasaka; Yasushi ;   et al.
2016-06-23
Semiconductor Device Manufacturing Method and Substrate Treatment System
App 20150017813 - AKIYAMA; Koji ;   et al.
2015-01-15
Semiconductor Device Manufacturing Method
App 20140242789 - Akasaka; Yasushi ;   et al.
2014-08-28
Semiconductor Device Manufacturing Method And Substrate Processing System
App 20140242808 - Akiyama; Koji ;   et al.
2014-08-28
Fabrication method of semiconductor device
Grant 8,741,786 - Akiyama , et al. June 3, 2
2014-06-03
Fabrication Method Of Semiconductor Device
App 20120309207 - AKIYAMA; Koji ;   et al.
2012-12-06
Semiconductor device and method of manufacturing the same
Grant 8,129,775 - Akiyama , et al. March 6, 2
2012-03-06
Semiconductor Device And Method Of Manufacturing The Same
App 20100148241 - AKIYAMA; Koji ;   et al.
2010-06-17

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