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Patent applications and USPTO patent grants for Higashida; Toshiyuki.The latest application filed is for "resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board".
Patent | Date |
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Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board Grant 10,450,405 - Nii , et al. Oc | 2019-10-22 |
Resin Composition, Prepreg, Metal Foil With Resin, Metal-clad Laminate, Printed Wiring Board App 20170226276 - NII; DAISUKE ;   et al. | 2017-08-10 |
Resin Composition, Prepreg, Metal Foil With Resin, Metal-clad Laminated Plate, And Printed Wiring Board App 20160234934 - HIGASHIDA; TOSHIYUKI ;   et al. | 2016-08-11 |
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