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HIGASHI; Toshifumi Patent Filings

HIGASHI; Toshifumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for HIGASHI; Toshifumi.The latest application filed is for "light source device".

Company Profile
1.2.9
  • HIGASHI; Toshifumi - Kirishima-shi JP
  • Higashi; Toshifumi - Kirishima JP
  • Higashi; Toshifumi - Kokubu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light Source Device
App 20220256675 - HIGASHI; Toshifumi ;   et al.
2022-08-11
Light-emitting-element housing member, array member, and light emitting device
Grant 11,362,484 - Higashi , et al. June 14, 2
2022-06-14
Electrical Element Mounting Package, Array Package, And Electrical Device
App 20220094135 - YAMAMOTO; Sentarou ;   et al.
2022-03-24
Lighting Device For A Vehicle And Vehicle
App 20220034475 - HIGASHI; Toshifumi ;   et al.
2022-02-03
Wiring Board, Composite Substrate, And Electric Device
App 20210410286 - HIGASHI; Toshifumi ;   et al.
2021-12-30
Substrate For Mounting A Light-emitting Element, Array Substrate, And Light-emitting Device
App 20210399520 - HIGASHI; Toshifumi ;   et al.
2021-12-23
Substrate For Mounting An Electronic Component, Electrical Device, And Light-emitting Device
App 20210391687 - YAMAGUCHI; Takafumi ;   et al.
2021-12-16
Light-emitting-element Housing Member, Array Member, And Light Emitting Device
App 20200220320 - HIGASHI; Toshifumi ;   et al.
2020-07-09
Electrical Element Mounting Package, Array Package, And Electrical Device
App 20190214784 - YAMAMOTO; Sentarou ;   et al.
2019-07-11
Glass ceramic sintered body and wiring board using the sintered body
Grant 6,953,756 - Kawai , et al. October 11, 2
2005-10-11
Glass ceramic sintered body and wiring board using the sintered body
App 20040087427 - Kawai, Shinya ;   et al.
2004-05-06

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