Higashi; Michiya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Higashi; Michiya.The latest application filed is for "resin-encapsulated semiconductor device".
- Higashi; Michiya - Kawasaki JP
| Patent | Date |
|---|---|
| Resin-encapsulated semiconductor device Grant 5,536,970 - Higashi , et al. July 16, 1 | 1996-07-16 |
| Semiconductor device encapsulant Grant 5,258,426 - Uchida , et al. * November 2, 1 | 1993-11-02 |
| Acid anhydride-cured epoxy resin encapsulant with triorganothiophosphite Grant 5,145,889 - Wada , et al. September 8, 1 | 1992-09-08 |
| Multimold semiconductor device and the manufacturing method therefor Grant 5,057,457 - Miyahara , et al. October 15, 1 | 1991-10-15 |
| Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used Grant 4,719,502 - Ikeya , et al. January 12, 1 | 1988-01-12 |
| Epoxy resin composition for encapsulation of semi-conductor device Grant 4,719,255 - Yoshizumi , et al. January 12, 1 | 1988-01-12 |
| Resin encapsulation type semiconductor device by use of epoxy resin composition Grant 4,710,796 - Ikeya , et al. December 1, 1 | 1987-12-01 |
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