| Patent | Date |
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Joining apparatus with UV cleaning
Grant 8,240,539 - Higashi , et al. August 14, 2 | 2012-08-14 |
Semiconductor light emitting device and semiconductor light emitting device mounted board
Grant 8,129,739 - Higashi , et al. March 6, 2 | 2012-03-06 |
Electronic element package and method of manufacturing the same
Grant 8,077,447 - Higashi , et al. December 13, 2 | 2011-12-13 |
Semiconductor element and semiconductor element fabrication method
Grant 7,994,634 - Kita , et al. August 9, 2 | 2011-08-09 |
Formation of a through-electrode by inkjet deposition of resin pastes
Grant 7,955,974 - Higashi June 7, 2 | 2011-06-07 |
Method For Forming Through Electrode And Semiconductor Device
App 20110057326 - Kai; Takayuki ; et al. | 2011-03-10 |
Electronic part and method of producing the same
Grant 7,790,594 - Higashi September 7, 2 | 2010-09-07 |
Packaged electronic element and method of producing electronic element package
Grant 7,692,292 - Higashi , et al. April 6, 2 | 2010-04-06 |
Semiconductor light emitting device and semiconductor light emitting device mounted board
App 20100012965 - Higashi; Kazushi ; et al. | 2010-01-21 |
Semiconductor device
Grant 7,646,095 - Higashi , et al. January 12, 2 | 2010-01-12 |
Semiconductor Through-electrode Forming Method
App 20090280647 - HIGASHI; Kazushi | 2009-11-12 |
Electronic device package manufacturing method and electronic device package
Grant 7,615,406 - Higashi , et al. November 10, 2 | 2009-11-10 |
Semiconductor Element And Semiconductor Element Fabrication Method
App 20090243120 - KITA; Takeshi ; et al. | 2009-10-01 |
Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device
Grant 7,554,126 - Higashi , et al. June 30, 2 | 2009-06-30 |
Component mounting tool, and method and apparatus for mounting component using this tool
Grant 7,549,567 - Higashi , et al. June 23, 2 | 2009-06-23 |
Electronic Part And Method Of Producing The Same
App 20090140410 - Higashi; Kazushi | 2009-06-04 |
Electronic Device Package Manufacturing Method and Electronic Device Package
App 20080277771 - Higashi; Kazushi ; et al. | 2008-11-13 |
Electronic Element Package And Method Of Manufacturing The Same
App 20080137270 - Higashi; Kazushi ; et al. | 2008-06-12 |
Apparatus and method for forming bump
Grant 7,350,684 - Narita , et al. April 1, 2 | 2008-04-01 |
Semiconductor Light-Emitting Element, Manufacturing Method and Mounting Method of the Same and Light-Emitting Device
App 20070262338 - Higashi; Kazushi ; et al. | 2007-11-15 |
Component Mounting Tool, And Method And Apparatus For Mounting Component Using This Tool
App 20070119905 - Higashi; Kazushi ; et al. | 2007-05-31 |
Component mounting apparatus including a polishing device
Grant 7,219,419 - Higashi , et al. May 22, 2 | 2007-05-22 |
Packaged electronic element and method of producing electronic element package
App 20070108634 - Higashi; Kazushi ; et al. | 2007-05-17 |
Semiconductor element having protruded bump electrodes
Grant 7,071,090 - Higashi , et al. July 4, 2 | 2006-07-04 |
Electronic part mounting apparatus and method
App 20060081974 - Higashi; Kazushi ; et al. | 2006-04-20 |
Joining apparatus and method
App 20060037997 - Higashi; Kazushi ; et al. | 2006-02-23 |
Electronic part mounting apparatus and method
Grant 6,996,889 - Higashi , et al. February 14, 2 | 2006-02-14 |
Apparatus and method for forming bump
App 20050191838 - Narita, Shoriki ; et al. | 2005-09-01 |
Semiconductor element having protruded bump electrodes
App 20050146029 - Higashi, Kazushi ; et al. | 2005-07-07 |
Device and method for forming bump
Grant 6,910,613 - Narita , et al. June 28, 2 | 2005-06-28 |
Semiconductor device and manufacturing method thereof
App 20050104173 - Higashi, Kazushi ; et al. | 2005-05-19 |
Semiconductor element having protruded bump electrodes
Grant 6,894,387 - Higashi , et al. May 17, 2 | 2005-05-17 |
Method for assembling integral type electronic device, and integral type electronic device
App 20050001315 - Higashi, Kazushi ; et al. | 2005-01-06 |
Method for assembling integral type electronic component and integral type electronic component
Grant 6,825,055 - Higashi , et al. November 30, 2 | 2004-11-30 |
Device and method for forming bump
App 20040102030 - Narita, Shoriki ; et al. | 2004-05-27 |
Electronic part mounting apparatus and method
App 20040022037 - Higashi, Kazushi ; et al. | 2004-02-05 |
Bump joining method
App 20030205607 - Minamitani, Shozo ; et al. | 2003-11-06 |
Component mounting tool, and method and apparatus for mounting component using this tool
App 20030150108 - Higashi, Kazushi ; et al. | 2003-08-14 |
Method and apparatus for mounting component
Grant 6,506,222 - Minamitani , et al. January 14, 2 | 2003-01-14 |
Bump bonding device and bump bonding method
App 20020030087 - Imanishi, Makoto ; et al. | 2002-03-14 |
Method for assembling integral type electronic component and integral type electronic component
App 20020028595 - Higashi, Kazushi ; et al. | 2002-03-07 |
Bump joining method
App 20020008132 - Minamitani, Shozo ; et al. | 2002-01-24 |
Bump bonding device and bump bonding method
Grant 6,328,196 - Imanishi , et al. December 11, 2 | 2001-12-11 |
Bump joining method
Grant 6,321,973 - Minamitani , et al. November 27, 2 | 2001-11-27 |
Method and apparatus for mounting component
App 20010026012 - Minamitani, Shozo ; et al. | 2001-10-04 |
Optical information processing apparatus
App 20010006219 - Kawai, Hideo ; et al. | 2001-07-05 |
Method of forming a ball bond using a bonding capillary
App 20010005054 - Higashi, Kazushi ; et al. | 2001-06-28 |
Method and apparatus for mounting component
App 20010001469 - Higashi, Kazushi ; et al. | 2001-05-24 |
Method of forming a ball bond using a bonding capillary
Grant 6,207,549 - Higashi , et al. March 27, 2 | 2001-03-27 |
Component mounting method and apparatus
Grant 6,193,136 - Higashi , et al. February 27, 2 | 2001-02-27 |
Semiconductor device and manufacturing method thereof
Grant 5,686,353 - Yagi , et al. November 11, 1 | 1997-11-11 |
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