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name:-0.0060451030731201
name:-0.007483959197998
name:-0.0005500316619873
Higano; Masanori Patent Filings

Higano; Masanori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Higano; Masanori.The latest application filed is for "winding state evaluation method for tape film and winding method for tape film".

Company Profile
0.7.7
  • Higano; Masanori - Isesaki JP
  • Higano; Masanori - Gunma JP
  • Higano; Masanori - Isezaki JP
  • Higano; Masanori - Isezaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Winding state evaluation method for tape film and winding method for tape film
Grant 8,289,810 - Tokunaga , et al. October 16, 2
2012-10-16
Winding State Evaluation Method For Tape Film And Winding Method For Tape Film
App 20100209688 - Tokunaga; Hisatsugu ;   et al.
2010-08-19
Cover tape and carrier tape system
Grant 7,704,591 - Ono , et al. April 27, 2
2010-04-27
Cover Film
App 20090246518 - Fujimura; Tetsuo ;   et al.
2009-10-01
Electronic component container
Grant 7,455,896 - Fujimura , et al. November 25, 2
2008-11-25
Transparent heat-sealing film
Grant 7,341,793 - Ishii , et al. March 11, 2
2008-03-11
Cover tape, and carrier tape system for packing electronic component
App 20070184243 - Ono; Takeshi ;   et al.
2007-08-09
Resin composition, molded product thereof and electroconductive sheet
Grant 6,960,390 - Kosugi , et al. November 1, 2
2005-11-01
Transparent heat-sealing film
App 20050192404 - Ishii, Masanori ;   et al.
2005-09-01
Transparent heat-sealing film
Grant 6,902,795 - Ishii , et al. June 7, 2
2005-06-07
Resin composition, molded product thereof and electroconductive sheet
Grant 6,759,130 - Kosugi , et al. July 6, 2
2004-07-06
Resin composition, molded product thereof and electroconductive sheet
App 20040048071 - Kosugi, Kazuhiro ;   et al.
2004-03-11
Electronic component container
App 20030183553 - Fujimura, Tetsuo ;   et al.
2003-10-02
Resin composition, molded product thereof and electroconductive sheet
App 20030049452 - Kosugi, Kazuhiro ;   et al.
2003-03-13

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