loadpatents
name:-0.4882800579071
name:-0.044785022735596
name:-0.00063705444335938
Hiew; Siew Sin Patent Filings

Hiew; Siew Sin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiew; Siew Sin.The latest application filed is for "high integration of intelligent non-volatile memory device".

Company Profile
0.8.12
  • Hiew; Siew Sin - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Single chip universal serial bus (USB) package with metal housing
Grant 7,878,852 - Hiew , et al. February 1, 2
2011-02-01
High integration of intelligent non-volatile memory device
Grant 7,877,542 - Chow , et al. January 25, 2
2011-01-25
Fixed write-protect seamless memory card
Grant 7,866,562 - Hiew , et al. January 11, 2
2011-01-11
Seamless secured digital card manufacturing methods with male guide and female switch
Grant 7,804,163 - Hiew , et al. September 28, 2
2010-09-28
Non-volatile memory device manufacturing process testing systems and methods thereof
Grant 7,802,155 - Hiew , et al. September 21, 2
2010-09-21
Two step molding process secured digital card manufacturing method and apparatus
Grant 7,795,714 - Hiew , et al. September 14, 2
2010-09-14
Plug and cap for a universal-serial-bus (USB) device
Grant 7,547,218 - Hiew , et al. June 16, 2
2009-06-16
Thin solid state drive housing structures
Grant 7,517,252 - Ni , et al. April 14, 2
2009-04-14
High Integration of Intelligent Non-volatile Memory Device
App 20080215802 - Chow; David Q. ;   et al.
2008-09-04
Non-Volatile Memory Device Manufacturing Process Testing Systems and Methods Thereof
App 20080201622 - Hiew; Siew Sin ;   et al.
2008-08-21
Thin Solid State Drive Housing Structures
App 20080192425 - NI; Jim Chin-Nan ;   et al.
2008-08-14
Single Side Package Memory Card
App 20080191030 - Ma; Abraham Chih-Kang ;   et al.
2008-08-14
Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors
App 20080185694 - Hiew; Siew Sin ;   et al.
2008-08-07
Plug and cap for a Universal-Serial-Bus (USB) device
App 20080064271 - Hiew; Siew Sin ;   et al.
2008-03-13
Single Chip Universal Serial Bus (USB) Package with Metal Housing
App 20080059680 - Hiew; Siew Sin ;   et al.
2008-03-06
Mid-Seam Package Methods of Manufacture for Memory Cards Using Ultraviolet Cure Adhesive and Ultra-Sonic Press
App 20080041966 - Hiew; Siew Sin ;   et al.
2008-02-21
Fixed Write-Protect Seamless Memory Card
App 20080037308 - Hiew; Siew Sin ;   et al.
2008-02-14
Two Step Molding Process Secured Digital Card Manufacturing Method and Apparatus
App 20080011860 - Hiew; Siew Sin ;   et al.
2008-01-17
Seamless Secured Digital Card Manufacturing Methods with Male Guide and Female Switch
App 20070262155 - Hiew; Siew Sin ;   et al.
2007-11-15
Wire under dam package and method for packaging image-sensor
App 20070120213 - Hiew; Siew Sin ;   et al.
2007-05-31

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