loadpatents
name:-0.033889055252075
name:-0.01786994934082
name:-0.00049185752868652
Hiew; Siew S. Patent Filings

Hiew; Siew S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiew; Siew S..The latest application filed is for "single shot molding method for cob usb/eusb devices with contact pad ribs".

Company Profile
0.20.27
  • Hiew; Siew S. - San Jose CA
  • HIEW; Siew S - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Single shot molding method for COB USB/EUSB devices with contact pad ribs
Grant 8,567,050 - Hiew , et al. October 29, 2
2013-10-29
Molded memory card with write protection switch assembly
Grant 8,254,134 - Hiew , et al. August 28, 2
2012-08-28
High throughput manufacturing method for micro flash memory cards
Grant 8,240,034 - Hiew , et al. August 14, 2
2012-08-14
Manufacturing method for micro-SD flash memory card
Grant 8,141,240 - Hiew , et al. March 27, 2
2012-03-27
Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs
App 20120030943 - Hiew; Siew S. ;   et al.
2012-02-09
Micro-SD to secure digital adaptor card and manufacturing method
Grant 8,102,658 - Hiew , et al. January 24, 2
2012-01-24
USB package with bistable sliding mechanism
Grant 8,102,662 - Hiew , et al. January 24, 2
2012-01-24
Single shot molding method for COB USB/EUSB devices with contact pad ribs
Grant 8,102,657 - Hiew , et al. January 24, 2
2012-01-24
Manufacturing method for single chip COB USB devices with optional embedded LED
Grant 7,874,067 - Hiew , et al. January 25, 2
2011-01-25
Extended COB-USB with dual-personality contacts
Grant 7,872,873 - Hiew , et al. January 18, 2
2011-01-18
Molding methods to manufacture single-chip chip-on-board USB device
Grant 7,872,871 - Hiew , et al. January 18, 2
2011-01-18
Light-weight solid state drive with rivet sets
Grant 7,869,218 - Ni , et al. January 11, 2
2011-01-11
Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
Grant 7,830,666 - Hiew , et al. November 9, 2
2010-11-09
USB Device With Connected Cap
App 20100248512 - Hiew; Siew S. ;   et al.
2010-09-30
USB device with connected cap
Grant 7,789,680 - Hiew , et al. September 7, 2
2010-09-07
Molded Memory Card With Write Protection Switch Assembly
App 20100110647 - Hiew; Siew S. ;   et al.
2010-05-06
Micro-SD To Secure Digital Adaptor Card And Manufacturing Method
App 20100105251 - Hiew; Siew S. ;   et al.
2010-04-29
High density memory device manufacturing using isolated step pads
Grant 7,687,921 - Hiew , et al. March 30, 2
2010-03-30
USB Package With Bistable Sliding Mechanism
App 20090316368 - Hiew; Siew S. ;   et al.
2009-12-24
High Density Memory Device Manufacturing Using Isolated Step Pads
App 20090273096 - Hiew; Siew S. ;   et al.
2009-11-05
USB Device With Connected Cap
App 20090258516 - Hiew; Siew S. ;   et al.
2009-10-15
Sporoderm-Broken Polypore Production
App 20090194616 - Hiew; Siew S. ;   et al.
2009-08-06
ESD Protection For USB Memory Devices
App 20090190277 - Hiew; Siew S. ;   et al.
2009-07-30
Single chip USB packages with contact-pins cover
Grant 7,535,719 - Hiew , et al. May 19, 2
2009-05-19
Reliable Memory Module Testing And Manufacturing Method
App 20090100295 - HIEW; Siew S. ;   et al.
2009-04-16
Uv-epoxy And Ultrasonic Case Assembly Methods For Usb Flash Drive
App 20090097215 - HIEW; Siew S ;   et al.
2009-04-16
Solid state drive (SSD) with open top and bottom covers
Grant 7,517,231 - Hiew , et al. April 14, 2
2009-04-14
Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs
App 20090093136 - Hiew; Siew S. ;   et al.
2009-04-09
Solid State Drive With Coverless Casing
App 20090086448 - HIEW; Siew S. ;   et al.
2009-04-02
Single chip USB packages with swivel cover
Grant 7,466,556 - Hiew , et al. December 16, 2
2008-12-16
Direct Package Mold Process For Single Chip SD Flash Cards
App 20080286990 - Hiew; Siew S. ;   et al.
2008-11-20
Single chip USB packages by various assembly methods
Grant 7,447,037 - Hiew , et al. November 4, 2
2008-11-04
Light-Weight Solid State Drive With Rivet Sets
App 20080266816 - Ni; Jim Chin-Nan ;   et al.
2008-10-30
Extended USB dual-personality card reader
Grant 7,440,286 - Hiew , et al. October 21, 2
2008-10-21
Manufacturing Method For Micro-SD Flash Memory Card
App 20080235939 - Hiew; Siew S. ;   et al.
2008-10-02
Extended COB-USB With Dual-Personality Contacts
App 20080218799 - Hiew; Siew S. ;   et al.
2008-09-11
SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
App 20080195817 - Hiew; Siew S. ;   et al.
2008-08-14
Manufacturing Method For Micro-SD Flash Memory Card
App 20080145968 - Hiew; Siew S. ;   et al.
2008-06-19
Single Chip USB Packages With Swivel Cover
App 20080094807 - Hiew; Siew S. ;   et al.
2008-04-24
Single Chip USB Packages With Contact-Pins Cover
App 20080093720 - Hiew; Siew S. ;   et al.
2008-04-24
Solid State Drive (SSD) With Open Top And Bottom Covers
App 20080089020 - Hiew; Siew S. ;   et al.
2008-04-17
Extended USB Dual-Personality Card Reader
App 20080067248 - Hiew; Siew S. ;   et al.
2008-03-20
Slim memory card with retractable protection shield
App 20080032561 - Hiew; Siew S. ;   et al.
2008-02-07
Single Chip USB Packages By Various Assembly Methods
App 20080020641 - Hiew; Siew S. ;   et al.
2008-01-24
Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board
App 20080006927 - Hiew; Siew S. ;   et al.
2008-01-10
Molding Methods To Manufacture Single-Chip Chip-On-Board USB Device
App 20070293088 - Hiew; Siew S. ;   et al.
2007-12-20

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