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Patent applications and USPTO patent grants for Hiew; Siew S..The latest application filed is for "single shot molding method for cob usb/eusb devices with contact pad ribs".
Patent | Date |
---|---|
Single shot molding method for COB USB/EUSB devices with contact pad ribs Grant 8,567,050 - Hiew , et al. October 29, 2 | 2013-10-29 |
Molded memory card with write protection switch assembly Grant 8,254,134 - Hiew , et al. August 28, 2 | 2012-08-28 |
High throughput manufacturing method for micro flash memory cards Grant 8,240,034 - Hiew , et al. August 14, 2 | 2012-08-14 |
Manufacturing method for micro-SD flash memory card Grant 8,141,240 - Hiew , et al. March 27, 2 | 2012-03-27 |
Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs App 20120030943 - Hiew; Siew S. ;   et al. | 2012-02-09 |
Micro-SD to secure digital adaptor card and manufacturing method Grant 8,102,658 - Hiew , et al. January 24, 2 | 2012-01-24 |
USB package with bistable sliding mechanism Grant 8,102,662 - Hiew , et al. January 24, 2 | 2012-01-24 |
Single shot molding method for COB USB/EUSB devices with contact pad ribs Grant 8,102,657 - Hiew , et al. January 24, 2 | 2012-01-24 |
Manufacturing method for single chip COB USB devices with optional embedded LED Grant 7,874,067 - Hiew , et al. January 25, 2 | 2011-01-25 |
Extended COB-USB with dual-personality contacts Grant 7,872,873 - Hiew , et al. January 18, 2 | 2011-01-18 |
Molding methods to manufacture single-chip chip-on-board USB device Grant 7,872,871 - Hiew , et al. January 18, 2 | 2011-01-18 |
Light-weight solid state drive with rivet sets Grant 7,869,218 - Ni , et al. January 11, 2 | 2011-01-11 |
Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board Grant 7,830,666 - Hiew , et al. November 9, 2 | 2010-11-09 |
USB Device With Connected Cap App 20100248512 - Hiew; Siew S. ;   et al. | 2010-09-30 |
USB device with connected cap Grant 7,789,680 - Hiew , et al. September 7, 2 | 2010-09-07 |
Molded Memory Card With Write Protection Switch Assembly App 20100110647 - Hiew; Siew S. ;   et al. | 2010-05-06 |
Micro-SD To Secure Digital Adaptor Card And Manufacturing Method App 20100105251 - Hiew; Siew S. ;   et al. | 2010-04-29 |
High density memory device manufacturing using isolated step pads Grant 7,687,921 - Hiew , et al. March 30, 2 | 2010-03-30 |
USB Package With Bistable Sliding Mechanism App 20090316368 - Hiew; Siew S. ;   et al. | 2009-12-24 |
High Density Memory Device Manufacturing Using Isolated Step Pads App 20090273096 - Hiew; Siew S. ;   et al. | 2009-11-05 |
USB Device With Connected Cap App 20090258516 - Hiew; Siew S. ;   et al. | 2009-10-15 |
Sporoderm-Broken Polypore Production App 20090194616 - Hiew; Siew S. ;   et al. | 2009-08-06 |
ESD Protection For USB Memory Devices App 20090190277 - Hiew; Siew S. ;   et al. | 2009-07-30 |
Single chip USB packages with contact-pins cover Grant 7,535,719 - Hiew , et al. May 19, 2 | 2009-05-19 |
Reliable Memory Module Testing And Manufacturing Method App 20090100295 - HIEW; Siew S. ;   et al. | 2009-04-16 |
Uv-epoxy And Ultrasonic Case Assembly Methods For Usb Flash Drive App 20090097215 - HIEW; Siew S ;   et al. | 2009-04-16 |
Solid state drive (SSD) with open top and bottom covers Grant 7,517,231 - Hiew , et al. April 14, 2 | 2009-04-14 |
Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs App 20090093136 - Hiew; Siew S. ;   et al. | 2009-04-09 |
Solid State Drive With Coverless Casing App 20090086448 - HIEW; Siew S. ;   et al. | 2009-04-02 |
Single chip USB packages with swivel cover Grant 7,466,556 - Hiew , et al. December 16, 2 | 2008-12-16 |
Direct Package Mold Process For Single Chip SD Flash Cards App 20080286990 - Hiew; Siew S. ;   et al. | 2008-11-20 |
Single chip USB packages by various assembly methods Grant 7,447,037 - Hiew , et al. November 4, 2 | 2008-11-04 |
Light-Weight Solid State Drive With Rivet Sets App 20080266816 - Ni; Jim Chin-Nan ;   et al. | 2008-10-30 |
Extended USB dual-personality card reader Grant 7,440,286 - Hiew , et al. October 21, 2 | 2008-10-21 |
Manufacturing Method For Micro-SD Flash Memory Card App 20080235939 - Hiew; Siew S. ;   et al. | 2008-10-02 |
Extended COB-USB With Dual-Personality Contacts App 20080218799 - Hiew; Siew S. ;   et al. | 2008-09-11 |
SD Flash Memory Card Manufacturing Using Rigid-Flex PCB App 20080195817 - Hiew; Siew S. ;   et al. | 2008-08-14 |
Manufacturing Method For Micro-SD Flash Memory Card App 20080145968 - Hiew; Siew S. ;   et al. | 2008-06-19 |
Single Chip USB Packages With Swivel Cover App 20080094807 - Hiew; Siew S. ;   et al. | 2008-04-24 |
Single Chip USB Packages With Contact-Pins Cover App 20080093720 - Hiew; Siew S. ;   et al. | 2008-04-24 |
Solid State Drive (SSD) With Open Top And Bottom Covers App 20080089020 - Hiew; Siew S. ;   et al. | 2008-04-17 |
Extended USB Dual-Personality Card Reader App 20080067248 - Hiew; Siew S. ;   et al. | 2008-03-20 |
Slim memory card with retractable protection shield App 20080032561 - Hiew; Siew S. ;   et al. | 2008-02-07 |
Single Chip USB Packages By Various Assembly Methods App 20080020641 - Hiew; Siew S. ;   et al. | 2008-01-24 |
Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board App 20080006927 - Hiew; Siew S. ;   et al. | 2008-01-10 |
Molding Methods To Manufacture Single-Chip Chip-On-Board USB Device App 20070293088 - Hiew; Siew S. ;   et al. | 2007-12-20 |
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