Hiei; Susumu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hiei; Susumu.The latest application filed is for "wiring module".
- Hiei; Susumu - Mie JP
| Patent | Date |
|---|---|
| Stacked connector and wire harness Grant 11,031,724 - Hiei , et al. June 8, 2 | 2021-06-08 |
| Wiring Module App 20200172031 - NAKANO; Haruka ; et al. | 2020-06-04 |
| Wire Harness Fixing Structure App 20200062198 - MIZUSHITA; Masaki ; et al. | 2020-02-27 |
| Stacked Connector And Wire Harness App 20200006885 - Hiei; Susumu ; et al. | 2020-01-02 |
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