Hideshima; Makoto
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hideshima; Makoto.The latest application filed is for "module-type semiconductor device of high power capacity".
- Hideshima; Makoto - Tokyo JP
- Hideshima; Makoto - Kawasaki JP
| Patent | Date |
|---|---|
| Module-type semiconductor device of high power capacity Grant 5,202,578 - Hideshima April 13, 1 | 1993-04-13 |
| Metal bump type semiconductor device and method for manufacturing the same Grant 5,143,865 - Hideshima , et al. September 1, 1 | 1992-09-01 |
| Conductivity modulation type semiconductor device and method for manufacturing the same Grant 5,128,277 - Hideshima , et al. July 7, 1 | 1992-07-07 |
| Semiconductor device with glass layer contacting outer periphery of guard ring and adjacent substrate Grant 4,400,716 - Tani , et al. August 23, 1 | 1983-08-23 |
| Semiconductor device Grant 4,267,557 - Muramoto , et al. May 12, 1 | 1981-05-12 |
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