Hidese; Wataru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hidese; Wataru.The latest application filed is for "screen printer".
- Hidese; Wataru - Fukuoka N/A JP
- Hidese; Wataru - Yamanashi JP
- Hidese; Wataru - Chikushino JP
- Hidese, Wataru - Chikushino-shi JP
- Hidese; Wataru - Ohikushino JP
| Patent | Date |
|---|---|
| Electric component mounting system and electric component mounting method Grant 9,198,336 - Kihara , et al. November 24, 2 | 2015-11-24 |
| Screen printer Grant 8,499,688 - Miyahara , et al. August 6, 2 | 2013-08-06 |
| Screen printer Grant 8,375,852 - Miyahara , et al. February 19, 2 | 2013-02-19 |
| Screen printer Grant 8,327,761 - Miyahara , et al. December 11, 2 | 2012-12-11 |
| Electronic component installation apparatus Grant 8,196,287 - Awata , et al. June 12, 2 | 2012-06-12 |
| Screen Printer App 20120090484 - Miyahara; Seiichi ; et al. | 2012-04-19 |
| Screen Printer App 20120085252 - MIYAHARA; Seiichi ; et al. | 2012-04-12 |
| Electronic Component Installation Apparatus App 20110023294 - Awata; Yoshiaki ; et al. | 2011-02-03 |
| Screen Printer App 20110017080 - Miyahara; Seiichi ; et al. | 2011-01-27 |
| Electric Component Mounting System And Electric Component Mounting Method App 20100071195 - Kihara; Masahiro ; et al. | 2010-03-25 |
| Electronic component mounting method Grant 7,243,420 - Haji , et al. July 17, 2 | 2007-07-17 |
| Method for mounting electronic parts onto a board Grant 7,137,195 - Haji , et al. November 21, 2 | 2006-11-21 |
| Method for mounting an electronic part by solder position detection Grant 7,059,043 - Hidese , et al. June 13, 2 | 2006-06-13 |
| Apparatus and method for mounting electronic parts App 20050108873 - Hidese, Wataru ; et al. | 2005-05-26 |
| Electronic component mounting apparatus Grant 6,874,225 - Haji , et al. April 5, 2 | 2005-04-05 |
| Component mounting method Grant 6,865,803 - Hidese March 15, 2 | 2005-03-15 |
| Method for mounting electronic parts on a board Grant 6,839,960 - Hidese , et al. January 11, 2 | 2005-01-11 |
| Electronic component mounting apparatus and electronic component mounting method App 20040205961 - Haji, Hiroshi ; et al. | 2004-10-21 |
| Apparatus and method for mounting electronic parts Grant 6,792,676 - Haji , et al. September 21, 2 | 2004-09-21 |
| Apparatus and method for mounting electronic parts App 20040148769 - Haji, Hiroshi ; et al. | 2004-08-05 |
| Component mounter and mounting method App 20030192178 - Hidese, Wataru | 2003-10-16 |
| Component mounter and mounting method Grant 6,606,790 - Hidese August 19, 2 | 2003-08-19 |
| Method employing X-Y tables for simultaneously mounting electronic parts Grant 6,588,096 - Hidese July 8, 2 | 2003-07-08 |
| Electronic component mounting apparatus and electronic component mounting method App 20030110623 - Haji, Hiroshi ; et al. | 2003-06-19 |
| Electronic components mounting device and the mounting method Grant 6,539,622 - Hidese , et al. April 1, 2 | 2003-04-01 |
| Apparatus and method for mounting electronic parts App 20030029033 - Hidese, Wataru ; et al. | 2003-02-13 |
| Apparatus and method for mounting electronic parts App 20030029032 - Haji, Hiroshi ; et al. | 2003-02-13 |
| Electronic component mounting method Grant 6,453,548 - Hidese September 24, 2 | 2002-09-24 |
| Electronic Components Mounting Device And The Mounting Method App 20020124397 - HIDESE, WATARU ; et al. | 2002-09-12 |
| Component mounter and mounting method App 20020053134 - Hidese, Wataru | 2002-05-09 |
| Apparatus and method for bonding outer leads Grant 5,338,381 - Hidese August 16, 1 | 1994-08-16 |
| Outer lead bonding head and method of bonding outer lead Grant 5,113,581 - Hidese May 19, 1 | 1992-05-19 |
| Electronic component mounting apparatus Grant 5,033,185 - Hidese July 23, 1 | 1991-07-23 |
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