Hidehira; Yorio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hidehira; Yorio.The latest application filed is for "ink jet resin composition and printed wiring board using the same".

Company Profile

4.5.6

Hidehira; Yorio - Okayama JP
HIDEHIRA; Yorio - Okayama-shi Okayama

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition for inkjet printing and printed wiring board prepared by using same Grant 11,390,766 - Hidehira , et al. July 19, 2	2022-07-19
Ink Jet Resin Composition And Printed Wiring Board Using The Same App 20200216690 - Hidehira; Yorio ; et al.	2020-07-09
A Resin Composition For Inkjet Printing And Printed Wiring Board Prepared By Using Same App 20200208001 - HIDEHIRA; Yorio ; et al.	2020-07-02
Method of preparing ink jet resin composition Grant 10,544,322 - Hidehira , et al. Ja	2020-01-28
Method Of Preparing Ink Jet Resin Composition App 20190153254 - Hidehira; Yorio ; et al.	2019-05-23
Method And Device For Fabricating Multi-piece Substrate App 20160021757 - HIDEHIRA; Yorio	2016-01-21
Method and apparatus for testing circuit boards Grant 7,188,037 - Hidehira March 6, 2	2007-03-06
Method and apparatus for testing circuit boards App 20060052957 - Hidehira; Yorio	2006-03-09
Impedance measuring device for printed wiring board Grant 6,856,152 - Hidehira February 15, 2	2005-02-15
Impedance measuring device for printed wiring board Grant 6,624,650 - Hidehira September 23, 2	2003-09-23
Impedance measuring device for printed wiring board App 20030117159 - Hidehira, Yorio	2003-06-26

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