Hiatt; William Mark

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hiatt; William Mark.The latest application filed is for "semiconductor devices comprising nickel-and copper-containing interconnects".

Company Profile

0.16.18

Hiatt; William Mark - Eagle ID
Hiatt; William Mark - Charlotte NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices comprising nickel-- and copper--containing interconnects Grant 10,446,440 - Akram , et al. Oc	2019-10-15
Semiconductor Devices Comprising Nickel-and Copper-containing Interconnects App 20180358263 - Akram; Salman ; et al.	2018-12-13
Semiconductor devices comprising nickel- and copper-containing interconnects Grant 10,062,608 - Akram , et al. August 28, 2	2018-08-28
Methods Of Forming Interconnects And Semiconductor Structures App 20170283954 - Akram; Salman ; et al.	2017-10-05
Methods of forming interconnects and semiconductor structures Grant 9,640,433 - Akram , et al. May 2, 2	2017-05-02
Methods Of Forming Interconnects And Semiconductor Structures App 20140154879 - Akram; Salman ; et al.	2014-06-05
Methods of forming conductive vias Grant 8,324,100 - Akram , et al. December 4, 2	2012-12-04
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 8,294,273 - Akram , et al. October 23, 2	2012-10-23
Optical Apertures And Applications Thereof App 20120154945 - Hiatt; William Mark	2012-06-21
Methods Of Forming Conductive Vias App 20110136336 - Akram; Salman ; et al.	2011-06-09
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed App 20110095429 - Akram; Salman ; et al.	2011-04-28
Methods for fabricating and filling conductive vias and conductive vias so formed Grant 7,892,972 - Akram , et al. February 22, 2	2011-02-22
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,709,776 - Farnworth , et al. May 4, 2	2010-05-04
Methods of packaging microelectronic imaging devices Grant 7,632,713 - Farnworth , et al. December 15, 2	2009-12-15
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers App 20090155949 - Farnworth; Warren M. ; et al.	2009-06-18
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,504,615 - Farnworth , et al. March 17, 2	2009-03-17
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages Grant 7,470,563 - Hiatt , et al. December 30, 2	2008-12-30
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level Grant 7,452,743 - Oliver , et al. November 18, 2	2008-11-18
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,265,330 - Farnworth , et al. September 4, 2	2007-09-04
Methods for fabricating and filling conductive vias and conductive vias so formed App 20070184654 - Akram; Salman ; et al.	2007-08-09
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20070170350 - Farnworth; Warren M. ; et al.	2007-07-26
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers Grant 7,189,954 - Farnworth , et al. March 13, 2	2007-03-13
Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level App 20070045632 - Oliver; Steven D. ; et al.	2007-03-01
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060243889 - Farnworth; Warren M. ; et al.	2006-11-02
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages Grant 7,087,995 - Hiatt , et al. August 8, 2	2006-08-08
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages App 20060057774 - Hiatt; William Mark ; et al.	2006-03-16
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers App 20060011809 - Farnworth; Warren M. ; et al.	2006-01-19
Microelectronic imaging devices and methods of packaging microelectronic imaging devices App 20050236708 - Farnworth, Warren M. ; et al.	2005-10-27
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages App 20040101991 - Hiatt, William Mark ; et al.	2004-05-27
System and method for monitoring ion implantation processing App 20040031934 - Hiatt, William Mark ; et al.	2004-02-19
Microelectronic Device Packages And Methods For Controlling The Disposition Of Non-conductive Materials In Such Packages App 20040005732 - Hiatt, William Mark ; et al.	2004-01-08
Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages Grant 6,673,649 - Hiatt , et al. January 6, 2	2004-01-06
Wafer carrier transport system for tool bays Grant 6,663,340 - Zeakes , et al. December 16, 2	2003-12-16
Method and system for cleaning a wafer chuck App 20030200996 - Hiatt, William Mark ; et al.	2003-10-30

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