Hiang; Tang Kok
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hiang; Tang Kok.The latest application filed is for "prediction of esl/ild remaining thickness".
- Hiang; Tang Kok - Singapore SG
| Patent | Date |
|---|---|
| Predictions of leakage modes in integrated circuits Grant 7,439,084 - Hiang , et al. October 21, 2 | 2008-10-21 |
| Predictions of leakage modes in integrated circuits App 20070196934 - Hiang; Tang Kok ; et al. | 2007-08-23 |
| Prediction of ESL/ILD remaining thickness App 20070196935 - Hiang; Tang Kok ; et al. | 2007-08-23 |
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