HFM Packaging, Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for HFM Packaging, Ltd..The latest application filed is for "resealable label flap with tamper evident structure".
- HFM Packaging, Ltd. - Pewaukee WI US
| Patent | Date |
|---|---|
| Resealable label flap with tamper evident structure Grant 9,650,194 - Hetherton May 16, 2 | 2017-05-16 |
| Resealable Label Flap With Tamper Evident Structure App 20160152393 - Hetherton; Scott | 2016-06-02 |
| Standup Pouch With Dispensing Fitment App 20120223178 - Riggs; Jon M. | 2012-09-06 |
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