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name:-0.0078780651092529
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Heymer; Heike Patent Filings

Heymer; Heike

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heymer; Heike.The latest application filed is for "device for reducing pressure in hollow bodies in media at higher temperatures".

Company Profile
0.3.2
  • Heymer; Heike - Dresden N/A DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device for reducing pressure in hollow bodies in media at higher temperatures
Grant 9,683,598 - Gusek , et al. June 20, 2
2017-06-20
Device For Reducing Pressure In Hollow Bodies In Media At Higher Temperatures
App 20140341493 - Gusek; Christopher ;   et al.
2014-11-20
Ceramic network, method for the production and utilization thereof
Grant 6,547,967 - Adler , et al. April 15, 2
2003-04-15

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