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Patent applications and USPTO patent grants for Heyke; Klaus.The latest application filed is for "monolithically integrated semiconductor assembly having a power component and method for producing a monolithically intergrated semiconductor assembly".
Patent | Date |
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Monolithically integrated semiconductor assembly having a power component and method for producing a monolithically integrated semiconductor assembly Grant 7,851,870 - Heyke December 14, 2 | 2010-12-14 |
Monolithically integrated semiconductor assembly having a power component and method for producing a monolithically intergrated semiconductor assembly App 20090206419 - Heyke; Klaus | 2009-08-20 |
Epoxy resin composition for encapsulating electric circuit components Grant 5,189,080 - Heyke , et al. February 23, 1 | 1993-02-23 |
Two semiconductor diode rectifier structure Grant 4,314,271 - Heyke , et al. February 2, 1 | 1982-02-02 |
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