Heyfitch; Vadim
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heyfitch; Vadim.The latest application filed is for "high density routing for heterogeneous package integration".
- Heyfitch; Vadim - Los Gatos CA
| Patent | Date |
|---|---|
| High density routing for heterogeneous package integration Grant 11,282,776 - Gandhi , et al. March 22, 2 | 2022-03-22 |
| Test structures for validating package fabrication process Grant 11,127,643 - Heyfitch , et al. September 21, 2 | 2021-09-21 |
| High Density Routing For Heterogeneous Package Integration App 20190259695 - Gandhi; Jaspreet Singh ; et al. | 2019-08-22 |
| Passive peaking circuit comprising a step-down impedance transformer Grant 9,066,391 - Heyfitch June 23, 2 | 2015-06-23 |
| Passive Peaking Circuit Comprising A Step-down Impedance Transformer App 20150156832 - Heyfitch; Vadim | 2015-06-04 |
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