Heyen; Janet
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heyen; Janet.The latest application filed is for "method for forming vias on printed circuit boards".
- Heyen; Janet - Rochester NY
- Heyen; Janet - Penfield NY
| Patent | Date |
|---|---|
| Method for forming vias on printed circuit boards Grant 9,999,137 - Ciufo , et al. June 12, 2 | 2018-06-12 |
| Method For Forming Vias On Printed Circuit Boards App 20160128201 - Ciufo; David ; et al. | 2016-05-05 |
| Method For Depositing And Curing Nanoparticle-based Ink App 20150189761 - Chan; Chun Wong Aaron ; et al. | 2015-07-02 |
| Performance Of Conductive Copper Paste Using Copper Flake App 20140287158 - Heyen; Janet ; et al. | 2014-09-25 |
| Conductive Paste Formulations For Improving Adhesion To Plastic Substrates App 20140287159 - Carmody; Michael ; et al. | 2014-09-25 |
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