Heussner; Daryl R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heussner; Daryl R..The latest application filed is for "spot-solderable leads for semiconductor device packages".
- Heussner; Daryl R. - Allen TX
| Patent | Date |
|---|---|
| Spot-solderable leads for semiconductor device packages Grant 11,430,719 - Prakuzhy , et al. August 30, 2 | 2022-08-30 |
| Spot-solderable leads for semiconductor device packages Grant 10,607,927 - Prakuzhy , et al. | 2020-03-31 |
| Spot-Solderable Leads for Semiconductor Device Packages App 20190318983 - Prakuzhy; Manu A. ; et al. | 2019-10-17 |
| Spot-Solderable Leads for Semiconductor Device Packages App 20180076116 - Prakuzhy; Manu J. ; et al. | 2018-03-15 |
| Scalable method for identifying cracks and fractures under wired or ball bonded bond pads App 20080246491 - Ogawa; Ennis T. ; et al. | 2008-10-09 |
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