loadpatents
name:-0.016211986541748
name:-0.0098230838775635
name:-0.0048449039459229
Heuck; Friedjof Patent Filings

Heuck; Friedjof

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heuck; Friedjof.The latest application filed is for "method for manufacturing a piezoelectric resonator".

Company Profile
4.9.19
  • Heuck; Friedjof - Stuttgart DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Manufacturing A Piezoelectric Resonator
App 20220231652 - Heuck; Friedjof ;   et al.
2022-07-21
Method For Producing A Wafer Connection
App 20210292160 - Heuck; Friedjof ;   et al.
2021-09-23
Micromechanical pressure sensor
Grant 11,060,937 - Lukacs , et al. July 13, 2
2021-07-13
Micromechanical Pressure Sensor Device And Corresponding Production Method
App 20210130161 - Heuck; Friedjof ;   et al.
2021-05-06
Micromechanical Device And Method For Manufacturing A Micromechanical Device
App 20210131897 - Heuck; Friedjof ;   et al.
2021-05-06
Bond Structures On Mems Element And Asic Element
App 20200399116 - Heuck; Friedjof ;   et al.
2020-12-24
Micromechanical yaw rate sensor and method for the production thereof
Grant 10,753,743 - Neul , et al. A
2020-08-25
Micromechanical yaw rate sensor and method for operating same
Grant 10,753,742 - Neul , et al. A
2020-08-25
Micromechanical Pressure Sensor
App 20190376864 - Lukacs; Ferenc ;   et al.
2019-12-12
Method for producing a multi-layer electrode system
Grant 10,217,926 - Pirk , et al. Feb
2019-02-26
Micromechanical Yaw Rate Sensor and Method for Operating Same
App 20190056226 - Neul; Reinhard ;   et al.
2019-02-21
Particle sensor and method for manufacturing a particle sensor
Grant 10,126,224 - Trautmann , et al. November 13, 2
2018-11-13
Micromechanical Yaw Rate Sensor and Method for the Production Thereof
App 20180321039 - Neul; Reinhard ;   et al.
2018-11-08
Assembly body for micromirror chips, mirror device and production method for a mirror device
Grant 10,012,828 - Schatz , et al. July 3, 2
2018-07-03
Interposer For Mounting A Vertically Integrated Hybrid Component On A Component Carrier
App 20170081177 - Neul; Reinhard ;   et al.
2017-03-23
Method for producing a micromechanical component, and corresponding micromechanical component
Grant 9,593,012 - Heuck , et al. March 14, 2
2017-03-14
Assembly Body For Micromirror Chips, Mirror Device And Production Method For A Mirror Device
App 20170052364 - Schatz; Frank ;   et al.
2017-02-23
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
Grant 9,428,378 - Heuck , et al. August 30, 2
2016-08-30
Particle Sensor And Method For Manufacturing A Particle Sensor
App 20160195464 - Trautmann; Achim ;   et al.
2016-07-07
Micromechanical spring for an inertial sensor
App 20160138666 - HOEPPNER; Christian ;   et al.
2016-05-19
Method for Producing a Micromechanical Component, and Corresponding Micromechanical Component
App 20160023895 - Heuck; Friedjof ;   et al.
2016-01-28
Production process for a micromechanical component and micromechanical component
Grant 9,233,841 - Heuck , et al. January 12, 2
2016-01-12
Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling Structure
App 20150353345 - HEUCK; Friedjof ;   et al.
2015-12-10
Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component
App 20150353346 - HEUCK; Friedjof ;   et al.
2015-12-10
Method and Device for Producing a Multi-Layer Electrode System
App 20150340592 - Pirk; Tjalf ;   et al.
2015-11-26
Micromechanical Structure And Coresponding Manufacturing Method
App 20140355094 - SCHORR; Nicolas ;   et al.
2014-12-04
Production Process For A Micromechanical Component And Micromechanical Component
App 20140103497 - Heuck; Friedjof ;   et al.
2014-04-17

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