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Patent applications and USPTO patent grants for Heucher; Reimar.The latest application filed is for "electrical debonding of pu hot melt adhesives by use of conductive inks".
Patent | Date |
---|---|
Debondable reactive hot melt adhesives Grant 10,800,956 - Heucher , et al. October 13, 2 | 2020-10-13 |
Electrical debonding of PU hot melt adhesives by use of conductive inks Grant 10,590,310 - Heucher , et al. | 2020-03-17 |
Electrical Debonding of PU Hot Melt Adhesives By Use of Conductive Inks App 20180340097 - Heucher; Reimar ;   et al. | 2018-11-29 |
Debondable Reactive Hot Melt Adhesives App 20170355892 - Heucher; Reimar ;   et al. | 2017-12-14 |
Polyamide Hot Melt Coating App 20170158909 - Marchese; Luca ;   et al. | 2017-06-08 |
Electrically Divisible Polyamide Adhesive App 20140374032 - Heucher; Reimar ;   et al. | 2014-12-25 |
Filling compound Grant 6,258,885 - Heucher , et al. July 10, 2 | 2001-07-10 |
Filling compound Grant 5,902,849 - Heucher , et al. May 11, 1 | 1999-05-11 |
Polyamide compositions and related methods Grant 5,807,968 - Heinrich , et al. September 15, 1 | 1998-09-15 |
Aqueous dispersions of polyamides Grant 5,804,682 - Fischer , et al. September 8, 1 | 1998-09-08 |
Aqueous dispersions of polyamides Grant 5,723,538 - Fischer , et al. March 3, 1 | 1998-03-03 |
Polyamide based on dimer fatty acid Grant 5,719,255 - Heucher , et al. February 17, 1 | 1998-02-17 |
Plug-type connector for coaxial cables Grant 5,510,405 - Heucher , et al. April 23, 1 | 1996-04-23 |
Lyo gel, its production and its use for sealing Grant 5,412,022 - Andres , et al. May 2, 1 | 1995-05-02 |
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