Hesse & Knipps GmbH
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hesse & Knipps GmbH.The latest application filed is for "bonding device, ultrasonic transducer, and bonding method".
- Hesse & Knipps GmbH - Paderborn DE
- Hesse & Knipps GmbH - DE DE
- HESSE & KNIPPS GmbH -
| Patent | Date |
|---|---|
| Bonding device, ultrasonic transducer, and bonding method Grant 8,434,659 - Hesse , et al. May 7, 2 | 2013-05-07 |
| Bonding Device, Ultrasonic Transducer, And Bonding Method App 20110266329 - Hesse; Hans-Juergen ; et al. | 2011-11-03 |
| Ultrasonic transducer comprising a sensor disposed in the mounting Grant 7,611,039 - Hesse , et al. November 3, 2 | 2009-11-03 |
| Camera-assisted adjustment of bonding head elements Grant 7,461,768 - Walther December 9, 2 | 2008-12-09 |
| Method of and apparatus for testing a wire bond connection Grant 7,134,591 - Walther November 14, 2 | 2006-11-14 |
| Cruciform ultrasonic transducer Grant 6,995,498 - Wallaschek , et al. February 7, 2 | 2006-02-07 |
| Method and components for flip-chip bonding Grant 6,946,745 - Hesse September 20, 2 | 2005-09-20 |
| Method of and apparatus for testing a wire bond connection App 20040226983 - Walther, Frank | 2004-11-18 |
| Contact assembly for a rotatable circuit element App 20040154824 - Hesse, Hans | 2004-08-12 |
| Cruciform ultrasonic transducer App 20030168938 - Wallaschek, Jorg ; et al. | 2003-09-11 |
| Method and components for flip-chip bonding App 20030151145 - Hesse, Hans | 2003-08-14 |
| Quality control method Grant 6,308,881 - Hesse , et al. October 30, 2 | 2001-10-30 |
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