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Hertler, Walter Raymond Patent Filings

Hertler, Walter Raymond

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hertler, Walter Raymond.The latest application filed is for "two component dispersant for wet milling process".

Company Profile
0.3.1
  • Hertler, Walter Raymond - Kennett Square PA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Two component dispersant for wet milling process
App 20020035173 - Ma, Sheau-Hwa ;   et al.
2002-03-21
Inks with enhanced substrate binding characteristics
Grant 6,306,994 - Donald , et al. October 23, 2
2001-10-23
Compositions for diffusion patterning
Grant 5,654,354 - Felten , et al. August 5, 1
1997-08-05
Aqueous ink jet inks
Grant 5,648,405 - Ma , et al. July 15, 1
1997-07-15

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