Herron; Lester W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Herron; Lester W..The latest application filed is for "high performance integrated mlc cooling device for high power density ics and method for manufacturing".

Company Profile

0.16.4

Herron; Lester W. - New Paltz NY
Herron; Lester W. - New Platz NY
Herron; Lester W. - Hopewell Junction NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing App 20080060792 - Berger; Daniel G. ; et al.	2008-03-13
High performance integrated MLC cooling device for high power density ICS and method for manufacturing Grant 7,255,153 - Berger , et al. August 14, 2	2007-08-14
High Performance Integrated Mlc Cooling Device For High Power Density Ics And Method For Manufacturing App 20060266497 - Berger; Daniel G. ; et al.	2006-11-30
Screening Nest, Method Of Screening Wiring Layers In A Multi-layer Ceramic And Cleaning The Screening Mask And Mask Cleaning Station App 20060157085 - Harmuth; John F. ; et al.	2006-07-20
Multi-chip module and heat-sink cap combination Grant 6,373,133 - DiGiacomo , et al. April 16, 2	2002-04-16
Method For The Controlling Of Certain Second Phases In Aluminum Nitride App 20010055703 - BATES, RICHARD A. ; et al.	2001-12-27
Aluminum nitride body having graded metallurgy Grant 5,552,232 - Casey , et al. September 3, 1	1996-09-03
Aluminum nitride body having graded metallurgy Grant 5,552,107 - Casey , et al. September 3, 1	1996-09-03
Large ceramic article and method of manufacturing Grant 5,541,005 - Bezama , et al. July 30, 1	1996-07-30
Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof Grant 5,480,503 - Casey , et al. January 2, 1	1996-01-02
Method and means for co-sintering ceramic/metal MLC substrates Grant 5,130,067 - Flaitz , et al. July 14, 1	1992-07-14
Processes for electrically conductive decals filled with inorganic insulator material Grant 5,108,541 - Schneider , et al. April 28, 1	1992-04-28
Multilayered ceramic substrate having solid non-porous metal conductors Grant 4,879,156 - Herron , et al. November 7, 1	1989-11-07
Diffusion isolation layer for maskless cladding process Grant 4,786,674 - Herron , et al. November 22, 1	1988-11-22
Method of controlling the sintering of metal particles Grant 4,776,978 - Herron , et al. October 11, 1	1988-10-11
Process for forming multilayered ceramic substrate having solid metal conductors Grant 4,753,694 - Herron , et al. June 28, 1	1988-06-28
Method of controlling the sintering of metal particles Grant 4,671,928 - Herron , et al. June 9, 1	1987-06-09
Method for removal of carbonaceous residues from ceramic structures having internal metallurgy Grant 4,627,160 - Herron , et al. December 9, 1	1986-12-09
Process for flattening glass-ceramic substrates Grant 4,340,436 - Dubetsky , et al. July 20, 1	1982-07-20
Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors Grant 4,234,367 - Herron , et al. November 18, 1	1980-11-18

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