Herrmann; Matthias Friedrich

Patent Applications and Registrations

Patent applications and USPTO patent grants for Herrmann; Matthias Friedrich.The latest application filed is for "combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor".

Company Profile

4.4.5

Herrmann; Matthias Friedrich - Muenchen DE
Herrmann; Matthias Friedrich - Munich DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Combined Corrugated Piezoelectric Microphone And Corrugated Piezoelectric Vibration Sensor App 20210385584 - Goswami; Somu ; et al.	2021-12-09
Membrane Support for Dual Backplate Transducers App 20210139319 - Klein; Wolfgang ; et al.	2021-05-13
Membrane support for dual backplate transducers Grant 10,981,780 - Klein , et al. April 20, 2	2021-04-20
Membrane Support For Dual Backplate Transducers App 20210053821 - Klein; Wolfgang ; et al.	2021-02-25
Microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device Grant 10,370,242 - Dehe , et al.	2019-08-06
System and method for a MEMS sensor Grant 10,175,130 - Kollias , et al. J	2019-01-08
Microelectromechanical Device, A Microelectromechanical System, And A Method Of Manufacturing A Microelectromechanical Device App 20180029878 - Dehe; Alfons ; et al.	2018-02-01
Sensor device and method for making thereof Grant 9,643,837 - Herrmann May 9, 2	2017-05-09
System and Method for a MEMS Sensor App 20160305835 - Kollias; Athanasios ; et al.	2016-10-20

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