Patent applications and USPTO patent grants for Herrick; Wendy.The latest application filed is for "nickel coated copper as electrodes for embedded passive devices".
Patent | Date |
---|---|
Printed circuit boards having integrated inductor cores Grant 6,763,575 - Meigs , et al. July 20, 2 | 2004-07-20 |
Substrate adhesion enhancement to film Grant 6,629,348 - Skorupski , et al. October 7, 2 | 2003-10-07 |
Nickel coated copper as electrodes for embedded passive devices Grant 6,610,417 - Andresakis , et al. August 26, 2 | 2003-08-26 |
Nickel coated copper as electrodes for embedded passive devices App 20030068517 - Andresakis, John A. ;   et al. | 2003-04-10 |
Printed circuit boards having integrated inductor cores App 20020196119 - Meigs, Jonathan ;   et al. | 2002-12-26 |
Substrate adhesion enhancement to film App 20020162218 - Skorupski, Edward C. ;   et al. | 2002-11-07 |
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