Hermanson; Chris
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hermanson; Chris.The latest application filed is for "over-mold packaging for wide band-gap semiconductor devices".
- Hermanson; Chris - Durham NC
| Patent | Date |
|---|---|
| Over-mold plastic packaged wide band-gap power transistors and MMICS Grant 9,515,011 - Wood , et al. December 6, 2 | 2016-12-06 |
| Over-mold packaging for wide band-gap semiconductor devices Grant 9,472,480 - Wood , et al. October 18, 2 | 2016-10-18 |
| Over-mold Plastic Packaged Wide Band-gap Power Transistors And Mmics App 20150348886 - Wood; Simon ; et al. | 2015-12-03 |
| Over-mold Packaging For Wide Band-gap Semiconductor Devices App 20150348885 - Wood; Simon ; et al. | 2015-12-03 |
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