Hermanowski; James

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hermanowski; James.The latest application filed is for "device to protect portable electronic systems".

Company Profile

2.8.14

Hermanowski; James - Waterbury VT US
- Waterbury VT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device to Protect Portable Electronic Systems App 20180115338 - Hermanowski; James ; et al.	2018-04-26
Method for thermal-slide debonding of temporary bonded semiconductor wafers Grant 9,281,229 - George , et al. March 8, 2	2016-03-08
Method For Thermal-slide Debonding Of Temporary Bonded Semiconductor Wafers App 20150083342 - GEORGE; GREGORY ; et al.	2015-03-26
Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers Grant 8,919,412 - George , et al. December 30, 2	2014-12-30
Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers Grant 08919412 -	2014-12-30
Multi-wavelength multi-lamp radiation sources and systems and apparatuses incorporating same Grant 8,699,138 - Cogger , et al. April 15, 2	2014-04-15
Consumer oriented method and system for preference management App 20140040038 - Hermanowski; James ; et al.	2014-02-06
Transmission-Efficient Light Couplings and Tools and Systems Utilizing Such Couplings App 20130331654 - Hermanowski; James	2013-12-12
Automated thermal slide debonder Grant 8,343,300 - Hermanowski January 1, 2	2013-01-01
Multi-Wavelength Multi-Lamp Radiation Sources and Systems and Apparatuses Incorporating Same App 20120307512 - Cogger; Jeffrey ; et al.	2012-12-06
Apparatus for mechanically debonding temporary bonded semiconductor wafers Grant 8,267,143 - George , et al. September 18, 2	2012-09-18
Apparatus for temporary wafer bonding and debonding Grant 8,181,688 - Johnson , et al. May 22, 2	2012-05-22
Automated Thermal Slide Debonder App 20120037307 - HERMANOWSKI; JAMES	2012-02-16
Automated Thermal Slide Debonder App 20110146901 - HERMANOWSKI; JAMES	2011-06-23
Apparatus For Thermal-slide Debonding Of Temporary Bonded Semiconductor Wafers App 20110010908 - GEORGE; GREGORY ; et al.	2011-01-20
Apparatus For Temporary Wafer Bonding And Debonding App 20110014774 - JOHNSON; HALE ; et al.	2011-01-20
Apparatus For Mechanically Debonding Temporary Bonded Semiconductor Wafers App 20100263794 - GEORGE; GREGORY ; et al.	2010-10-21
Rapid Fabrication Of A Microelectronic Temporary Support For Inorganic Substrates App 20100264566 - MOORE; John ; et al.	2010-10-21

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