Herko, Lawrence H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Herko, Lawrence H..The latest application filed is for "methods of forming semiconductor structure".
- Herko, Lawrence H. - Palmyra NY
- Herko; Lawrence H. - Walworth NY
| Patent | Date |
|---|---|
| Methods of forming semiconductor structure App 20020086452 - Kneezel, Gary A. ; et al. | 2002-07-04 |
| Method of back cutting silicon wafers during a dicing procedure Grant 5,668,061 - Herko , et al. September 16, 1 | 1997-09-16 |
| Layered resinoid/diamond blade for precision cutting operations and method of manufacturing same Grant 5,637,388 - White , et al. June 10, 1 | 1997-06-10 |
| Ink jet printhead with sealed manifold and printhead die Grant 5,515,089 - Herko , et al. May 7, 1 | 1996-05-07 |
| Teflon filled resinoid dicing blades for fabricating silicon die modules Grant 5,494,698 - White , et al. February 27, 1 | 1996-02-27 |
| Two-step dieing process to form an ink jet face Grant 5,408,739 - Altavela , et al. April 25, 1 | 1995-04-25 |
| Method of reducing chipping and contamination of reservoirs and channels in thermal ink printheads during dicing by vacuum impregnation with protective filler material Grant 5,306,370 - Herko , et al. April 26, 1 | 1994-04-26 |
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