Hering; Ronald L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hering; Ronald L..The latest application filed is for "chip package assembly using chip heat to cure and verify".

Company Profile

0.7.7

Hering; Ronald L. - Pleasant Valley NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip Package Assembly Using Chip Heat To Cure And Verify App 20090098666 - Hering; Ronald L. ; et al.	2009-04-16
Circuit Board Cam-action Standoff Connector App 20080232072 - Edwards; David L. ; et al.	2008-09-25
Circuit board cam-action standoff connector Grant 7,394,666 - Edwards , et al. July 1, 2	2008-07-01
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip Grant 7,239,516 - Long , et al. July 3, 2	2007-07-03
Expandable standoff connector with slit collar and related method Grant 7,086,896 - Edwards , et al. August 8, 2	2006-08-08
Circuit Board Cam-action Standoff Connector App 20060090927 - Edwards; David L. ; et al.	2006-05-04
Expandable Standoff Connector With Slit Collar And Related Method App 20060094296 - Edwards; David L. ; et al.	2006-05-04
Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip App 20060056156 - Long; David C. ; et al.	2006-03-16
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,964,885 - Coico , et al. November 15, 2	2005-11-15
Stress resistant land grid array (LGA) module and method of forming the same App 20040141296 - Coico, Patrick Anthony ; et al.	2004-07-22
Stress resistant land grid array (LGA) module and method of forming the same Grant 6,703,560 - Coico , et al. March 9, 2	2004-03-09
Process and apparatus for improved module assembly using shape memory alloy springs Grant 6,436,223 - Edwards , et al. August 20, 2	2002-08-20
Stress resistant land grid array (LGA) module and method of forming the same App 20020050398 - Coico, Patrick Anthony ; et al.	2002-05-02
Method for assembling a multi-layered ceramic package Grant 6,332,946 - Emmett , et al. December 25, 2	2001-12-25

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