Herbsommer; Juan A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Herbsommer; Juan A..The latest application filed is for "interchip communication using a dielectric waveguide".

Company Profile

1.21.23

Herbsommer; Juan A. - Allen TX
Herbsommer; Juan A - Allen TX
Herbsommer; Juan A. - Schnecksville PA US
Herbsommer; Juan A - Schnecksville PA
Herbsommer, Juan A. - Berkeley Heights NJ
Herbsommer; Juan A. - de Bariloche AR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Dielectric waveguide core between ground planes secured in a channel Grant 10,251,258 - Herbsommer , et al.	2019-04-02
Ultra-thin power transistor and synchronous buck converter having customized footprint Grant 9,779,967 - Herbsommer , et al. October 3, 2	2017-10-03
High performance power transistor having ultra-thin package Grant 9,508,633 - Herbsommer , et al. November 29, 2	2016-11-29
Interchip Communication Using A Dielectric Waveguide App 20160309581 - Herbsommer; Juan A. ; et al.	2016-10-20
Microstrip line of different widths, ground planes of different distances Grant 9,405,064 - Herbsommer , et al. August 2, 2	2016-08-02
Ultra-thin Power Transistor And Synchronous Buck Converter Having Customized Footprint App 20160005627 - HERBSOMMER; Juan A ; et al.	2016-01-07
Ultra-thin power transistor and synchronous buck converter having customized footprint Grant 9,165,865 - Herbsommer , et al. October 20, 2	2015-10-20
Fabricating a power supply converter with load inductor structured as heat sink Grant 8,910,369 - Herbsommer , et al. December 16, 2	2014-12-16
Dc-dc Converter Vertically Integrated With Load Inductor Structured As Heat Sink App 20140247562 - Herbsommer; Juan A. ; et al.	2014-09-04
DC-DC converter vertically integrated with load inductor structured as heat sink Grant 8,760,872 - Herbsommer , et al. June 24, 2	2014-06-24
Encapsulating Package For An Integrated Circuit App 20140103508 - Herbsommer; Juan A.	2014-04-17
Interchip Communication Using Embedded Dielectric And Metal Waveguides App 20130265734 - Herbsommer; Juan A. ; et al.	2013-10-10
Interchip Communication Using An Embedded Dielectric Waveguide App 20130265733 - Herbsommer; Juan A. ; et al.	2013-10-10
Interchip Communication Using A Dielectric Waveguide App 20130265732 - Herbsommer; Juan A. ; et al.	2013-10-10
Synchronous buck converter having coplanar array of contact bumps of equal volume Grant 8,546,925 - Herbsommer , et al. October 1, 2	2013-10-01
Power converter having integrated capacitor Grant 8,431,979 - Herbsommer , et al. April 30, 2	2013-04-30
DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink App 20130077250 - HERBSOMMER; Juan A. ; et al.	2013-03-28
Synchronous Buck Converter Having Coplanar Array of Contact Bumps of Equal Volume App 20130075893 - HERBSOMMER; Juan A. ; et al.	2013-03-28
Semiconductor device package and method of assembly thereof Grant 8,389,336 - Herbsommer , et al. March 5, 2	2013-03-05
High Performance Power Transistor Having Ultra-Thin Package App 20130049077 - HERBSOMMER; Juan A. ; et al.	2013-02-28
Wirebond-less semiconductor package Grant 8,304,903 - Herbsommer , et al. November 6, 2	2012-11-06
Ultra-Thin Power Transistor and Synchronous Buck Converter Having Customized Footprint App 20120256239 - HERBSOMMER; Juan A. ; et al.	2012-10-11
Power Converter Having Integrated Capacitor App 20120248521 - HERBSOMMER; Juan A. ; et al.	2012-10-04
Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing App 20120200281 - HERBSOMMER; Juan A. ; et al.	2012-08-09
High Frequency Power Supply Module Having High Efficiency and High Current App 20110210708 - HERBSOMMER; Juan A. ; et al.	2011-09-01
Packaging for electronic modules Grant 7,433,192 - Bambridge , et al. October 7, 2	2008-10-07
Intelligent high-power amplifier module Grant 7,215,204 - Bambridge , et al. May 8, 2	2007-05-08
Intelligent high-power amplifier module App 20060139089 - Bambridge; Timothy B. ; et al.	2006-06-29
Packaging for electronic modules App 20060139896 - Bambridge; Timothy B. ; et al.	2006-06-29
Process for fabricating a power hybrid module App 20040212081 - Carberry, Patrick J. ; et al.	2004-10-28
Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom Grant 6,674,291 - Barber , et al. January 6, 2	2004-01-06

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