Herbsommer; Juan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Herbsommer; Juan.The latest application filed is for "background suppression for mm-wave spectroscopy".

Company Profile

3.8.7

Herbsommer; Juan - Allen TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Background suppression for doppler-free mm-wave spectroscopy Grant 11,280,746 - Dellis , et al. March 22, 2	2022-03-22
Background suppression for MM-wave spectroscopy Grant 11,204,378 - Dellis , et al. December 21, 2	2021-12-21
Millimeter wave molecular sensor Grant 11,119,038 - Dellis , et al. September 14, 2	2021-09-14
Background Suppression For Doppler-free Mm-wave Spectroscopy App 20210199598 - DELLIS; Argyrios ; et al.	2021-07-01
Background Suppression For Mm-wave Spectroscopy App 20210199702 - DELLIS; Argyrios ; et al.	2021-07-01
Zeeman splitting vector magnetometer apparatus and method Grant 10,634,738 - Cook , et al.	2020-04-28
Package for chip scale magnetometer or atomic clock Grant 10,539,630 - Herbsommer , et al. Ja	2020-01-21
Method and apparatus to reduce the leakage rate of a hermetic cavity Grant 10,374,621 - Herbsommer , et al.	2019-08-06
Zeeman Splitting Vector Magnetometer Apparatus and Method App 20190033400 - Cook; Benjamin ; et al.	2019-01-31
Package For Chip Scale Magnetometer Or Atomic Clock App 20180156875 - Herbsommer; Juan ; et al.	2018-06-07
Method and Apparatus To Reduce The Leakage Rate of a Hermetic Cavity App 20180159547 - Herbsommer; Juan ; et al.	2018-06-07
Integrated circuit ("IC") assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer Grant 9,553,068 - Lopez , et al. January 24, 2	2017-01-24
Wire Bonding Method And Structure App 20150262965 - Lopez; Osvaldo Jorge ; et al.	2015-09-17
Integrated circuit ("IC") assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer Grant 9,076,891 - Lopez , et al. July 7, 2	2015-07-07
Wire Bonding Method And Structure App 20140210064 - Lopez; Osvaldo Jorge ; et al.	2014-07-31

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