Heraeus Materials Singapore Pte. Ltd.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heraeus Materials Singapore Pte. Ltd..The latest application filed is for "process for electrically connecting contact surfaces of electroniccomponents".
- Heraeus Materials Singapore Pte. Ltd. - Singapore SG
| Patent | Date |
|---|---|
| Process For Electrically Connecting Contact Surfaces Of Electroniccomponents App 20220037284 - Pun; Yean M. ; et al. | 2022-02-03 |
| Coated wire Grant 11,236,430 - Lim , et al. February 1, 2 | 2022-02-01 |
| Method For Increasing The Straightness Of A Thin Wire App 20210301366 - LIU; Zhen Yun ; et al. | 2021-09-30 |
| Coated Wire App 20210222313 - Lim; Yee Weon ; et al. | 2021-07-22 |
| Coated wire Grant 10,960,498 - Kang , et al. March 30, 2 | 2021-03-30 |
| Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal Grant 10,399,186 - Pan , et al. Sep | 2019-09-03 |
| Method For Manufacturing A Composite Wire App 20180363115 - RICHTER; Rene ; et al. | 2018-12-20 |
| Method For Manufacturing A Passivated Product App 20180363146 - RICHTER; Rene ; et al. | 2018-12-20 |
| Composite Wire App 20180366238 - RICHTER; Rene ; et al. | 2018-12-20 |
| Method For Manufacturing A Cable App 20180366239 - RICHTER; Rene ; et al. | 2018-12-20 |
| Coated Wire App 20180345421 - Kang; Il Tae ; et al. | 2018-12-06 |
| Lead-free Eutectic Solder Alloy Comprising Zinc As The Main Component And Aluminum As An Alloying Metal App 20170036307 - PAN; Wei Chih ; et al. | 2017-02-09 |
| Copper Bond Wire And Method Of Making The Same App 20160078980 - SARANGAPANI; Murali ; et al. | 2016-03-17 |
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