Heppler; Steven W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heppler; Steven W..The latest application filed is for "electronic devices".
- Heppler; Steven W. - Boise ID US
| Patent | Date |
|---|---|
| Electronic devices Grant 8,508,034 - Bolken , et al. August 13, 2 | 2013-08-13 |
| Electronic Devices App 20120126386 - Bolken; Todd O. ; et al. | 2012-05-24 |
| Electronic device package Grant 8,115,296 - Bolken , et al. February 14, 2 | 2012-02-14 |
| Electronic Device Package App 20100264532 - Bolken; Todd O. ; et al. | 2010-10-21 |
| Methods for assembling semiconductor devices and interposers Grant 7,528,007 - Fee , et al. May 5, 2 | 2009-05-05 |
| Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Grant 7,274,095 - Fee , et al. September 25, 2 | 2007-09-25 |
| Methods for assembling semiconductor devices and interposers App 20060194373 - Fee; Setho Sing ; et al. | 2006-08-31 |
| Molding tool and a method of forming an electronic device package App 20060169490 - Bolken; Todd O. ; et al. | 2006-08-03 |
| Moisture-resistant electronic device package and methods of assembly Grant 7,026,548 - Bolken , et al. April 11, 2 | 2006-04-11 |
| Blades, saws, and methods for cutting microfeature workpieces App 20060005672 - Chapman; Gregory M. ; et al. | 2006-01-12 |
| Moisture-resistant Electronic Device Package And Methods Of Assembly App 20050263312 - Bolken, Todd O. ; et al. | 2005-12-01 |
| Moisture-resistant electronic device package and methods of assembly Grant 6,953,891 - Bolken , et al. October 11, 2 | 2005-10-11 |
| Moisture-resistant electronic device package and methods of assembly App 20050057883 - Bolken, Todd O. ; et al. | 2005-03-17 |
| Ball grid array interposer, packages and methods App 20040217459 - Fee, Setho Sing ; et al. | 2004-11-04 |
| Ball grid array interposer, packages and methods Grant 6,746,894 - Fee , et al. June 8, 2 | 2004-06-08 |
| Ball grid array interposer, packages and methods App 20020142513 - Fee, Setho Sing ; et al. | 2002-10-03 |
| IC pin forming machine with integrated IC testing capability Grant 5,248,075 - Young , et al. September 28, 1 | 1993-09-28 |
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