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Patent applications and USPTO patent grants for Heppler; Steve W..The latest application filed is for "electrical interconnect using locally conductive adhesive".
Patent | Date |
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Electrical interconnect using locally conductive adhesive Grant 7,998,305 - Cobbley , et al. August 16, 2 | 2011-08-16 |
Electrical interconnect using locally conductive adhesive Grant 7,829,190 - Cobbley , et al. November 9, 2 | 2010-11-09 |
Electrical Interconnect Using Locally Conductive Adhesive App 20080093019 - Cobbley; Chad A. ;   et al. | 2008-04-24 |
Electrical interconnect using locally conductive adhesive Grant 7,326,316 - Cobbley , et al. February 5, 2 | 2008-02-05 |
Electrical interconnect using locally conductive adhesive App 20060003157 - Cobbley; Chad A. ;   et al. | 2006-01-05 |
Method and apparatus for testing integrated circuits Grant RE38,894 - Heppler November 29, 2 | 2005-11-29 |
Electrical interconnect using locally conductive adhesive Grant 6,951,684 - Cobbley , et al. October 4, 2 | 2005-10-04 |
Electrical interconnect using locally conductive adhesive App 20040232391 - Cobbley, Chad A. ;   et al. | 2004-11-25 |
Electrical interconnect using locally conductive adhesive App 20040229032 - Cobbley, Chad A. ;   et al. | 2004-11-18 |
Electrical interconnect using locally conductive adhesive App 20040209497 - Cobbley, Chad A. ;   et al. | 2004-10-21 |
Electrical interconnect using locally conductive adhesive Grant 6,777,071 - Cobbley , et al. August 17, 2 | 2004-08-17 |
Electrical interconnect using locally conductive adhesive App 20030203668 - Cobbley, Chad A. ;   et al. | 2003-10-30 |
Method and apparatus for testing integrated circuits Grant 5,348,164 - Heppler September 20, 1 | 1994-09-20 |
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