Heppler; Steve W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heppler; Steve W..The latest application filed is for "electrical interconnect using locally conductive adhesive".

Company Profile

0.7.6

Heppler; Steve W. - Boise ID
Heppler; Steve W. - Kuna ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical interconnect using locally conductive adhesive Grant 7,998,305 - Cobbley , et al. August 16, 2	2011-08-16
Electrical interconnect using locally conductive adhesive Grant 7,829,190 - Cobbley , et al. November 9, 2	2010-11-09
Electrical Interconnect Using Locally Conductive Adhesive App 20080093019 - Cobbley; Chad A. ; et al.	2008-04-24
Electrical interconnect using locally conductive adhesive Grant 7,326,316 - Cobbley , et al. February 5, 2	2008-02-05
Electrical interconnect using locally conductive adhesive App 20060003157 - Cobbley; Chad A. ; et al.	2006-01-05
Method and apparatus for testing integrated circuits Grant RE38,894 - Heppler November 29, 2	2005-11-29
Electrical interconnect using locally conductive adhesive Grant 6,951,684 - Cobbley , et al. October 4, 2	2005-10-04
Electrical interconnect using locally conductive adhesive App 20040232391 - Cobbley, Chad A. ; et al.	2004-11-25
Electrical interconnect using locally conductive adhesive App 20040229032 - Cobbley, Chad A. ; et al.	2004-11-18
Electrical interconnect using locally conductive adhesive App 20040209497 - Cobbley, Chad A. ; et al.	2004-10-21
Electrical interconnect using locally conductive adhesive Grant 6,777,071 - Cobbley , et al. August 17, 2	2004-08-17
Electrical interconnect using locally conductive adhesive App 20030203668 - Cobbley, Chad A. ; et al.	2003-10-30
Method and apparatus for testing integrated circuits Grant 5,348,164 - Heppler September 20, 1	1994-09-20

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