HEO; Jun Yeong
Patent Applications and Registrations
Patent applications and USPTO patent grants for HEO; Jun Yeong.The latest application filed is for "semiconductor package".
- HEO; Jun Yeong - Suwon-si KR
| Patent | Date |
|---|---|
| Semiconductor Package App 20220293565 - SHIN; Seung Hun ; et al. | 2022-09-15 |
| Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing same Grant 11,069,541 - Ko , et al. July 20, 2 | 2021-07-20 |
| Semiconductor device and package including modified region of less density at edge of device or substrate Grant 10,804,212 - Ko , et al. October 13, 2 | 2020-10-13 |
| Semiconductor Device Package And Method Of Manufacturing Same App 20200126814 - KO; YEONG KWON ; et al. | 2020-04-23 |
| Semiconductor Device And Semiconductor Package Having The Same App 20200020641 - KO; YEONG-KWON ; et al. | 2020-01-16 |
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