Hengst; Edward Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hengst; Edward Lee.The latest application filed is for "contact module for a header assembly".
- Hengst; Edward Lee - Glen Rock PA
| Patent | Date |
|---|---|
| Contact module for a header assembly Grant 11,283,222 - Trout , et al. March 22, 2 | 2022-03-22 |
| Contact Module For A Header Assembly App 20220059974 - Trout; David Allison ; et al. | 2022-02-24 |
| Electrical connector assembly having signal modules and ground shields Grant 9,401,569 - Davis , et al. July 26, 2 | 2016-07-26 |
| Electrical Connector System App 20160099532 - Davis; Wayne Samuel ; et al. | 2016-04-07 |
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