HENG; Yang Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for HENG; Yang Hong.The latest application filed is for "integrated circuit package with v-shaped notch creepage structure".

Company Profile

0.6.8

HENG; Yang Hong - Muar MY
Heng; Yang Hong - Johor MY
Heng; Yang Hong - Muar Johor MY
Heng; Yang Hong - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit Package With V-shaped Notch Creepage Structure App 20220157681 - HENG; Yang Hong	2022-05-19
Semiconductor chip assembly Grant 8,482,119 - Lim , et al. July 9, 2	2013-07-09
Electronic device having profiled elements extending from planar surfaces Grant 8,030,742 - Lim , et al. October 4, 2	2011-10-04
Semiconductor module for a switched-mode power supply and method for its assembly Grant 7,923,827 - Heng , et al. April 12, 2	2011-04-12
Lead frame with non-conductive connective bar Grant 7,795,712 - Tatt , et al. September 14, 2	2010-09-14
Semiconductor Device, Leadframe And Method Of Encapsulating App 20100193920 - Poh; Yong Chern ; et al.	2010-08-05
Method of manufacture of encapsulated package Grant 7,674,657 - Heng , et al. March 9, 2	2010-03-09
Semiconductor chip assembly App 20090315172 - Lim; Fong ; et al.	2009-12-24
Electronic Device App 20090140403 - Lim; Boon Kian ; et al.	2009-06-04
Lead Frame with Non-Conductive Connective Bar App 20090051017 - Wee; Beng Tatt ; et al.	2009-02-26
Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly App 20090001535 - Heng; Yang Hong ; et al.	2009-01-01
Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus App 20080308952 - Heng; Yang Hong	2008-12-18
Method of Manufacture of Encapsulated Package App 20080157433 - Heng; Chai Wei ; et al.	2008-07-03

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