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Patent applications and USPTO patent grants for Heng; Stephen F..The latest application filed is for "circuit board socket with rail frame".
Patent | Date |
---|---|
Circuit board socket with rail frame Grant 10,389,053 - Heng , et al. A | 2019-08-20 |
Circuit Board Socket With Rail Frame App 20170104286 - Heng; Stephen F. ;   et al. | 2017-04-13 |
Circuit board socket with rail frame Grant 9,466,900 - Heng , et al. October 11, 2 | 2016-10-11 |
Method of mounting a circuit board Grant 8,938,876 - Heng , et al. January 27, 2 | 2015-01-27 |
Package Retention Frame App 20140043768 - Hardikar; Mahesh ;   et al. | 2014-02-13 |
Low profile semiconductor device socket Grant 8,425,246 - Heng April 23, 2 | 2013-04-23 |
Semiconductor chip package with stiffener frame and configured lid Grant 8,216,887 - Heng , et al. July 10, 2 | 2012-07-10 |
Circuit Board Socket With Support Structure App 20120083169 - Heng; Stephen F. ;   et al. | 2012-04-05 |
Semiconductor Chip Package with Stiffener Frame and Configured Lid App 20100276799 - Heng; Stephen F. ;   et al. | 2010-11-04 |
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