Heng; Kock Liang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Heng; Kock Liang.The latest application filed is for "semiconductor device having an interconnect structure with tsv using encapsulant for structural support".

Company Profile

0.12.10

Heng; Kock Liang - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Grant 9,054,083 - Suthiwongsunthorn , et al. June 9, 2	2015-06-09
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 9,029,193 - Marimuthu , et al. May 12, 2	2015-05-12
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20140110861 - Suthiwongsunthorn; Nathapong ; et al.	2014-04-24
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Grant 8,659,162 - Suthiwongsunthorn , et al. February 25, 2	2014-02-25
Semiconductor device and method of forming an interposer package with through silicon vias Grant 8,263,439 - Marimuthu , et al. September 11, 2	2012-09-11
Wafer integrated with permanent carrier and method therefor Grant 8,125,073 - Han , et al. February 28, 2	2012-02-28
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20120013004 - Suthiwongsunthorn; Nathapong ; et al.	2012-01-19
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Grant 8,067,308 - Suthiwongsunthorn , et al. November 29, 2	2011-11-29
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 8,049,328 - Marimuthu , et al. November 1, 2	2011-11-01
Wafer Integrated With Permanent Carrier and Method Therefor App 20110101509 - Han; Byung Joon ; et al.	2011-05-05
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias App 20110024916 - Marimuthu; Pandi Chelvam ; et al.	2011-02-03
Wafer integrated with permanent carrier and method therefor Grant 7,880,293 - Han , et al. February 1, 2	2011-02-01
Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20100308443 - Suthiwongsunthorn; Nathapong ; et al.	2010-12-09
Semiconductor device and method of forming an interposer package with through silicon vias Grant 7,838,337 - Marimuthu , et al. November 23, 2	2010-11-23
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support App 20100221873 - Marimuthu; Pandi Chelvam ; et al.	2010-09-02
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support App 20100213610 - Marimuthu; Pandi Chelvam ; et al.	2010-08-26
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 7,741,148 - Marimuthu , et al. June 22, 2	2010-06-22
Semiconductor Device And Method Of Forming An Interconnect Structure For 3-d Devices Using Encapsulant For Structural Support App 20100140815 - Marimuthu; Pandi Chelvam ; et al.	2010-06-10
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias App 20100133704 - Marimuthu; Pandi Chelvam ; et al.	2010-06-03
Wafer Integrated with Permanent Carrier and Method Therefor App 20090243083 - Han; Byung Joon ; et al.	2009-10-01

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