Heng; Chai Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Heng; Chai Wei.The latest application filed is for "method of fabricating a semiconductor device having a resin with warpage compensated structures".
- Heng; Chai Wei - Melaka N/A MY
| Patent | Date |
|---|---|
| Method of fabricating a semiconductor device having a resin with warpage compensated structures Grant 8,377,753 - Heng , et al. February 19, 2 | 2013-02-19 |
| Electronic component and a method of fabricating an electronic component Grant 8,207,601 - Low , et al. June 26, 2 | 2012-06-26 |
| Method of Fabricating A Semiconductor Device Having A Resin With Warpage Compensated Structures App 20120058606 - Heng; Chai Wei ; et al. | 2012-03-08 |
| Semiconductor devices having a resin with warpage compensated surfaces Grant 8,067,841 - Heng , et al. November 29, 2 | 2011-11-29 |
| Method of manufacture of encapsulated package Grant 7,674,657 - Heng , et al. March 9, 2 | 2010-03-09 |
| Semiconductor Device App 20090212446 - Heng; Chai Wei ; et al. | 2009-08-27 |
| Electronic Component and a Method of Fabricating an Electronic Component App 20090001536 - Low; Khai Huat Jeffrey ; et al. | 2009-01-01 |
| Method of Manufacture of Encapsulated Package App 20080157433 - Heng; Chai Wei ; et al. | 2008-07-03 |
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