loadpatents
name:-0.00096917152404785
name:-0.01134181022644
name:-0.0012719631195068
Hendricks; Douglas W. Patent Filings

Hendricks; Douglas W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hendricks; Douglas W..The latest application filed is for "method and structure for attaching a circuit module to a circuit board".

Company Profile
0.9.0
  • Hendricks; Douglas W. - Boca Raton FL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and structure for attaching a circuit module to a circuit board
Grant 5,598,967 - Greenwood , et al. February 4, 1
1997-02-04
Apparatus for selectively applying solder paste to multiple types of printed circuit boards
Grant 5,452,656 - Becher , et al. September 26, 1
1995-09-26
Wire bond pad arrangement having improved pad density
Grant 5,444,303 - Greenwood , et al. August 22, 1
1995-08-22
Direct chip attachment structure and method
Grant 5,439,162 - George , et al. August 8, 1
1995-08-08
Method and apparatus for selectively applying solder paste to multiple types of printed circuit boards
Grant 5,436,028 - Becher , et al. July 25, 1
1995-07-25
Anchoring method for flow formed integrated circuit covers
Grant 5,336,931 - Juskey , et al. August 9, 1
1994-08-09
Method and apparatus for use in forming pre-positioned solder bumps on a pad arrangement
Grant 5,323,947 - Juskey , et al. June 28, 1
1994-06-28
Process for photoimaging a three dimensional printed circuit substrate
Grant 5,001,038 - Dorinski , et al. March 19, 1
1991-03-19
Method for effecting solder interconnects
Grant 4,889,275 - Mullen, III , et al. December 26, 1
1989-12-26

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