Henderson; Donald W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Henderson; Donald W..The latest application filed is for "additives for grain fragmentation in pb-free sn-based solder".

Company Profile

0.19.23

Henderson; Donald W. - Ithaca NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,910,853 - Arvin , et al. December 16, 2	2014-12-16
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20130284495 - Arvin; Charles L. ; et al.	2013-10-31
Additives for grain fragmentation in Pb-free Sn-based solder Grant 8,493,746 - Arvin , et al. July 23, 2	2013-07-23
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2	2012-11-20
Modification Of Solder Alloy Compositions To Suppress Interfacial Void Formation In Solder Joints App 20120205425 - Gruber; Peter A. ; et al.	2012-08-16
Modification Of Solder Alloy Compositions To Suppress Interfacial Void Formation In Solder Joints App 20120201596 - Gruber; Peter A. ; et al.	2012-08-09
Modification of solder alloy compositions to suppress interfacial void formation in solder joints Grant 8,157,158 - Gruber , et al. April 17, 2	2012-04-17
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2	2011-04-26
Method and process for reducing undercooling in a lead-free tin-rich solder alloy Grant 7,784,669 - Hougham , et al. August 31, 2	2010-08-31
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER App 20100200271 - Arvin; Charles L. ; et al.	2010-08-12
Method And Process For Reducing Undercooling In A Lead-free Tin-rich Solder Alloy App 20100155456 - HOUGHAM; GARETH G. ; et al.	2010-06-24
Method and process for reducing undercooling in a lead-free tin-rich solder alloy Grant 7,703,661 - Hougham , et al. April 27, 2	2010-04-27
Method to accommodate increase in volume expansion during solder reflow Grant 7,703,199 - Caletka , et al. April 27, 2	2010-04-27
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al.	2010-03-11
Modification Of Pb-free Solder Alloy Compositions To Improve Interlayer Dielectric Delamination In Silicon Devices And Electromigration Resistance In Solder Joints App 20090197114 - Shih; Da-Yuan ; et al.	2009-08-06
Modification Of Pb-free Solder Alloy Compositions To Improve Interlayer Dielectric Delamination In Silicon Devices And Electromigration Resistance In Solder Joints App 20090197103 - Shih; Da-Yuan ; et al.	2009-08-06
Method And Process For Reducing Undercooling In A Lead-free Tin-rich Solder Alloy App 20080290142 - Hougham; Gareth G. ; et al.	2008-11-27
Modification Of Solder Alloy Compositions To Suppress Interfacial Void Formation In Solder Joints App 20080182124 - Gruber; Peter A. ; et al.	2008-07-31
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al.	2008-07-03
Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure App 20080008900 - Cheng; Yu-Ting ; et al.	2008-01-10
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure Grant 7,273,803 - Cheng , et al. September 25, 2	2007-09-25
Structure to accommodate increase in volume expansion during solder reflow App 20060208030 - Caletka; David Vincent ; et al.	2006-09-21
Method of accommodating in volume expansion during solder reflow Grant 7,086,147 - Caletka , et al. August 8, 2	2006-08-08
Fluidic cooling systems and methods for electronic components Grant 7,079,393 - Colgan , et al. July 18, 2	2006-07-18
Fluidic Cooling Systems And Methods For Electronic Components App 20060104031 - Colgan; Evan George ; et al.	2006-05-18
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder Grant 6,921,015 - Bernier , et al. July 26, 2	2005-07-26
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure App 20050118437 - Cheng, Yu-Ting ; et al.	2005-06-02
Stabilizing Copper Overlayer For Enhanced C4 Interconnect Reliability App 20050104208 - Bartelo, James C. ; et al.	2005-05-19
Lead-free tin-silver-copper alloy solder composition Grant 6,805,974 - Choi , et al. October 19, 2	2004-10-19
Structure to accommodate increase in volume expansion during solder reflow App 20040183094 - Caletka, David Vincent ; et al.	2004-09-23
Structure to accommodate increase in volume expansion during solder reflow Grant 6,686,664 - Caletka , et al. February 3, 2	2004-02-03
Negative volume expansion lead-free electrical connection Grant 6,649,833 - Caletka , et al. November 18, 2	2003-11-18
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder App 20030178473 - Bernier, William E. ; et al.	2003-09-25
Lead-free tin-silver-copper alloy solder composition App 20030156969 - Choi, Won K. ; et al.	2003-08-21
Punch actuator monitoring system and method Grant 6,598,505 - Henderson , et al. July 29, 2	2003-07-29
Flux composition and soldering method for high density arrays Grant 6,550,667 - Bernier , et al. April 22, 2	2003-04-22
Structure to accommodate increase in volume expansion during solder reflow App 20020158110 - Caletka, David Vincent ; et al.	2002-10-31
Flux composition and soldering method for high density arrays App 20020063146 - Bernier, William E. ; et al.	2002-05-30
Composition for increasing activity of a no-clean flux App 20010025673 - Henderson, Donald W. ; et al.	2001-10-04
Punch actuator monitoring system and method App 20010006016 - Henderson, Donald W. ; et al.	2001-07-05
Composition for increasing activity of a no-clean flux Grant 6,217,671 - Henderson , et al. April 17, 2	2001-04-17

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