Henderson; Brian M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Henderson; Brian M..The latest application filed is for "semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device".

Company Profile

0.14.13

Henderson; Brian M. - San Diego CA
Henderson; Brian M. - Escondido CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrostatic protection for stacked multi-chip integrated circuits Grant 9,184,130 - Henderson , et al. November 10, 2	2015-11-10
Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device Grant 9,153,461 - Henderson , et al. October 6, 2	2015-10-06
Electrostatic discharge diode Grant 9,093,462 - Ramachandran , et al. July 28, 2	2015-07-28
Semiconductor device having stacked memory elements and method of stacking memory elements on a semiconductor device Grant 9,041,220 - Henderson , et al. May 26, 2	2015-05-26
Semiconductor Device Having Stacked Memory Elements And Method Of Stacking Memory Elements On A Semiconductor Device App 20150102509 - HENDERSON; Brian M. ; et al.	2015-04-16
Electrostatic Discharge Diode App 20140327105 - Ramachandran; Vidhya ; et al.	2014-11-06
Through-substrate Via With A Fuse Structure App 20140266286 - Ramachandran; Vidhya ; et al.	2014-09-18
Semiconductor Device Having Stacked Memory Elements And Method Of Stacking Memory Elements On A Semiconductor Device App 20140225280 - Henderson; Brian M. ; et al.	2014-08-14
Power Distribution And Thermal Solution For Direct Stacked Integrated Circuits App 20140225248 - Henderson; Brian M. ; et al.	2014-08-14
Electrostatic Protection For Stacked Multi-chip Integrated Circuits App 20140098448 - Henderson; Brian M. ; et al.	2014-04-10
Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly Grant 8,604,626 - Henderson , et al. December 10, 2	2013-12-10
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Grant 8,557,680 - Chandrasekaran , et al. October 15, 2	2013-10-15
Reduced Susceptibility To Electrostatic Discharge During 3d Semiconductor Device Bonding And Assembly App 20130127046 - Henderson; Brian M. ; et al.	2013-05-23
Forming radio frequency integrated circuits Grant 8,362,599 - Kim , et al. January 29, 2	2013-01-29
Intra-die routing using back side redistribution layer and associated method Grant 8,319,325 - Henderson , et al. November 27, 2	2012-11-27
Semiconductor Wafer-to-wafer Bonding For Dissimilar Semiconductor Dies And/or Wafers App 20120276716 - Chandrasekaran; Arvind ; et al.	2012-11-01
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Grant 8,242,543 - Chandrasekaran , et al. August 14, 2	2012-08-14
Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly Grant 8,198,736 - Henderson , et al. June 12, 2	2012-06-12
Forming Radio Frequency Integrated Circuits App 20110068433 - Kim; Jonghae ; et al.	2011-03-24
Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor Dies And/Or Wafers App 20110049694 - Chandrasekaran; Arvind ; et al.	2011-03-03
Intra-Die Routing Using Back Side Redistribution Layer and Associated Method App 20100314737 - Henderson; Brian M. ; et al.	2010-12-16
Reduced Susceptibility To Electrostatic Discharge During 3D Semiconductor Device Bonding and Assembly App 20100258949 - Henderson; Brian M. ; et al.	2010-10-14
Integrated circuit for measuring mask misalignment Grant 4,647,850 - Henderson , et al. March 3, 1	1987-03-03

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