loadpatents
name:-0.021660089492798
name:-0.012187004089355
name:-0.0050508975982666
Henckens; Anja Patent Filings

Henckens; Anja

Patent Applications and Registrations

Patent applications and USPTO patent grants for Henckens; Anja.The latest application filed is for "electrically conductive silicone composition with high adhesion strength".

Company Profile
4.11.16
  • Henckens; Anja - Zonhoven BE
  • Henckens; Anja - Neerpelt BE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrically Conductive Silicone Composition With High Adhesion Strength
App 20220154046 - Henckens; Anja ;   et al.
2022-05-19
Sinterable composition for use in solar photovoltaic cells
Grant 11,075,309 - Zhang , et al. July 27, 2
2021-07-27
Electrically Conductive Adhesive For Attaching Solar Cells
App 20210139750 - Estruga Ortiga; Marc ;   et al.
2021-05-13
Processing of polymer based inks and pastes
Grant 10,920,098 - Van Der Meulen , et al. February 16, 2
2021-02-16
Curing a heat-curable material in an embedded curing zone
Grant 10,717,236 - van den Brand , et al.
2020-07-21
Electrically conductive adhesives
Grant 10,524,364 - Henckens Dec
2019-12-31
Processing Of Polymer Based Inks And Pastes
App 20190169457 - VAN DER MEULEN; Inge ;   et al.
2019-06-06
Electrically Conductive Composition And Applications For Said Composition
App 20190057792 - Ruyters; Michel ;   et al.
2019-02-21
Sinterable Composition For Use In Solar Photovoltaic Cells
App 20180182907 - Zhang; Chao ;   et al.
2018-06-28
Curable compositions comprising composite particles
Grant 9,914,855 - Henckens , et al. March 13, 2
2018-03-13
Electrically conductive adhesives comprising silver-coated particles
Grant 9,770,886 - Dreezen , et al. September 26, 2
2017-09-26
Sinterable Metal Particles And The Use Thereof In Electronics Applications
App 20170018325 - THEUNISSEN; Liesbeth ;   et al.
2017-01-19
Electrically Conductive Inks
App 20160035910 - Wu; Kily ;   et al.
2016-02-04
Curing A Heat-curable Material In An Embedded Curing Zone
App 20150367560 - van den Brand; Jeroen ;   et al.
2015-12-24
Curable Compositions Comprising Composite Particles
App 20150159057 - HENCKENS; Anja ;   et al.
2015-06-11
Electrically Conductive Adhesives Comprising Silver-coated Particles
App 20140178671 - Dreezen; Gunther ;   et al.
2014-06-26
Electrically Conductive Adhesives
App 20120177930 - Henckens; Anja
2012-07-12
Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including same
Grant 7,666,978 - Vanderzande , et al. February 23, 2
2010-02-23
Method Of Preparing Derivatives Of Polyarylene Vinylene And Method Of Preparing An Electronic Device Including Same
App 20090270575 - Vanderzande; Dirk ;   et al.
2009-10-29
Method Of Preparing Derivatives Of Polyarylene Vinylene And Method Of Preparing An Electronic Device Including Same
App 20090183767 - Vanderzande; Dirk ;   et al.
2009-07-23
Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including same
Grant 7,511,116 - Vanderzande , et al. March 31, 2
2009-03-31
Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including same
Grant 7,446,164 - Vanderzande , et al. November 4, 2
2008-11-04
Method Of Preparing Derivatives Of Polyarylene Vinylene And Method Of Preparing An Electronic Device Including Same
App 20080045684 - Vanderzande; Dirk ;   et al.
2008-02-21
Method Of Preparing Derivatives Of Polyarylene Vinylene And Method Of Preparing An Electronic Device Including Same
App 20070287816 - Vanderzande; Dirk ;   et al.
2007-12-13
Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including same
Grant 7,259,228 - Vanderzande , et al. August 21, 2
2007-08-21
Method of preparing derivatives of polyarylene vinylene and method of preparing an electronic device including same
App 20050159581 - Vanderzande, Dirk ;   et al.
2005-07-21

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