Hen; Chang Hsiu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hen; Chang Hsiu.The latest application filed is for "package socket and package legs structure for led and manufacturing of the same".
- Hen; Chang Hsiu - HsinChu TW
- Hen; Chang Hsiu - Hsin-Chu TW
| Patent | Date |
|---|---|
| Package socket and package legs structure for led and manufacturing of the same Grant 6,621,223 - Hen September 16, 2 | 2003-09-16 |
| Package Socket And Package Legs Structure For Led And Manufacturing Of The Same App 20030168989 - Hen, Chang Hsiu | 2003-09-11 |
| Electrode structure of LED and manufacturing of the same App 20030146445 - Hen, Chang Hsiu | 2003-08-07 |
| Package structure of full color LED form by overlap cascaded die bonding Grant 6,563,139 - Hen May 13, 2 | 2003-05-13 |
| Package structure of full color LED form by overlap cascaded die bonding App 20030047742 - Hen, Chang Hsiu | 2003-03-13 |
| Package structure containing two LEDs App 20020180345 - Hen, Chang Hsiu | 2002-12-05 |
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