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name:-0.029147148132324
name:-0.028250932693481
name:-0.00069189071655273
Hellekson; Ronald A. Patent Filings

Hellekson; Ronald A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hellekson; Ronald A..The latest application filed is for "laminate manifolds for mesoscale fluidic systems".

Company Profile
0.26.24
  • Hellekson; Ronald A. - Eugene OR
  • Hellekson; Ronald A - Eugene OR
  • Hellekson; Ronald A. - Corvallis OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Laminate manifolds for mesoscale fluidic systems
Grant 10,124,589 - Arthur , et al. November 13, 2
2018-11-13
Laminate Manifolds For Mesoscale Fluidic Systems
App 20180099502 - Arthur; Alan R. ;   et al.
2018-04-12
Laminate manifolds for mesoscale fluidic systems
Grant 9,868,284 - Arthur , et al. January 16, 2
2018-01-16
Laminate Manifolds For Mesoscale Fluidic Systems
App 20170096005 - Arthur; Alan R. ;   et al.
2017-04-06
Print head die
Grant 8,876,256 - Fricke , et al. November 4, 2
2014-11-04
Print head array testing
Grant 8,733,885 - Gardner , et al. May 27, 2
2014-05-27
Print Head Die
App 20130201256 - Fricke; Peter J. ;   et al.
2013-08-08
Mandrel
Grant 8,293,455 - Arthur , et al. October 23, 2
2012-10-23
Pixel well electrodes
Grant 8,199,305 - Arthur , et al. June 12, 2
2012-06-12
Bonded structures formed by plasma enhanced bonding
Grant 8,174,094 - Chen , et al. May 8, 2
2012-05-08
Pixel well electrode
Grant 7,838,313 - Arthur , et al. November 23, 2
2010-11-23
Pixel Well Electrodes
App 20100177272 - Arthur; Alan R. ;   et al.
2010-07-15
Mandrel
App 20100092889 - Arthur; Alan R. ;   et al.
2010-04-15
Pixel well electrodes
Grant 7,656,493 - Arthur , et al. February 2, 2
2010-02-02
Bonded structures formed by plasma enhanced bonding
App 20090256882 - Chen; Chien-Hua ;   et al.
2009-10-15
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
Grant 7,563,691 - Chen , et al. July 21, 2
2009-07-21
Pixel Well Electrodes
App 20090032815 - Arthur; Alan R. ;   et al.
2009-02-05
Pixel Well Electrode
App 20090032816 - Arthur; Alan R. ;   et al.
2009-02-05
Display Apparatus With Resistor Multiplexer
App 20090027303 - Arthur; Alan R. ;   et al.
2009-01-29
Thin Film Transistor
App 20080265257 - Fricke; Peter James ;   et al.
2008-10-30
Method of forming a through-substrate interconnect
Grant 7,432,582 - Lai , et al. October 7, 2
2008-10-07
Systems and methods for wafer bonding by localized induction heating
Grant 7,332,411 - McKinnell , et al. February 19, 2
2008-02-19
System and method for calculating a shift value between pattern instances
Grant 7,289,868 - Picciotto , et al. October 30, 2
2007-10-30
Laser delamination of thin metal film using sacrificial polymer layer
App 20070210420 - Nelson; Curt Lee ;   et al.
2007-09-13
System and method for calculating a shift value between pattern instances
App 20070043465 - Picciotto; Carl E. ;   et al.
2007-02-22
Mechanism to aid optical beam focusing on optical disc
Grant 7,103,896 - Pate , et al. September 5, 2
2006-09-05
Ink-jet printing of coupling agents for trace or circuit deposition templating
App 20060093732 - Schut; David ;   et al.
2006-05-04
Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
App 20060093787 - Chen; Chien-Hua ;   et al.
2006-05-04
Systems and methods for wafer bonding by localized induction heating
App 20060033201 - McKinnell; James ;   et al.
2006-02-16
Die carrier with fluid chamber
Grant 6,917,099 - Hellekson , et al. July 12, 2
2005-07-12
Method of forming a through-substrate interconnect
Grant 6,902,872 - Lai , et al. June 7, 2
2005-06-07
Method of forming a through-substrate interconnect
App 20050101040 - Lai, Daine ;   et al.
2005-05-12
Die carrier
App 20050045974 - Hellekson, Ronald A. ;   et al.
2005-03-03
Fluid ejector head having a planar passivation layer
Grant 6,834,942 - Trueba , et al. December 28, 2
2004-12-28
Fluid ejector head having a planar passivation layer
App 20040212663 - Trueba, Kenneth E. ;   et al.
2004-10-28
Mechanism to aid optical beam focusing on optical disc
App 20040202067 - Pate, Michael A ;   et al.
2004-10-14
Printhead nozzle alignment in a printing system
Grant 6,779,869 - Hendricks , et al. August 24, 2
2004-08-24
Fluid ejector head having a planar passivation layer
Grant 6,767,474 - Trueba , et al. July 27, 2
2004-07-27
Method of forming a through-substrate interconnect
Grant 6,716,737 - Plas , et al. April 6, 2
2004-04-06
Method Of Forming A Through-substrate Interconnect
App 20040018712 - Plas, Hubert Vander ;   et al.
2004-01-29
Method of forming a through-substrate interconnect
App 20040017419 - Lai, Diane ;   et al.
2004-01-29
Fluid ejector head having a planar passivation layer
App 20040012653 - Trueba, Kenneth E. ;   et al.
2004-01-22
Printhead nozzle alignment in a printing system
App 20030143008 - Hendricks, Jeffrey T. ;   et al.
2003-07-31
Lead frame-mounted ink jet print head module
Grant 6,227,651 - Watts , et al. May 8, 2
2001-05-08
Optical scan pattern generating arrangement for a laser scanner
Grant 4,861,973 - Hellekson , et al. August 29, 1
1989-08-29
Shallow bar code scanner
Grant 4,799,164 - Hellekson , et al. January 17, 1
1989-01-17
Bar code scanner with DC brushless motor
Grant 4,709,195 - Hellekson , et al. November 24, 1
1987-11-24
Trifocal lens for a laser instrument
Grant 4,678,288 - Lonsdale , et al. July 7, 1
1987-07-07

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